Salary
≈ $22k – $52k per year (Estimated)
Location
In office (Bengaluru)
Seniority
Senior · 5+ years exp
Employment
Full-Time
Overview
Company
Impact
Profile match
Bosch is a German engineering and technology group founded in Stuttgart in 1886 by Robert Bosch as a workshop for precision mechanics and electrical engineering. It is the largest automotive supplier in the world, making braking, steering, powertrain, sensor and driver assistance systems for nearly every carmaker, and it also produces power tools, home appliances through BSH, industrial drives through Rexroth, and building security and heating systems. Around ninety per cent of the company is owned by a charitable foundation, an ownership structure that gives it unusual freedom to invest across long research cycles including semiconductors and hydrogen.
Bosch Global Software Technologies Private Limited is a 100% owned subsidiary of Robert Bosch GmbH, one of the world's leading global supplier of technology and services, offering end-to-end Engineering, IT and Business Solutions. With over 27,000+ associates, it’s the largest software development center of Bosch, outside Germany, indicating that it is the Technology Powerhouse of Bosch in India with a global footprint and presence in the US, Europe and the Asia Pacific region.
Key Responsibilities:
- Lead hardware design and development for ADAS, Cockpit, and Connectivity ECUs, from concept to production
- Design high-speed digital boards with advanced SoCs, DDR4/DDR5, LPDDR interfaces, PCIe, Ethernet (RGMII/SGMII/RMII/10G), USB, MIPI CSI/DSI, and SerDes.
- Perform schematic design, component selection, and BOM optimization ensuring automotive-grade reliability and cost efficiency.
- Conduct Signal Integrity (SI) and Power Integrity (PI) analysis for critical high-speed signals and power rails.
- Support thermal design and validation, collaborating with mechanical and thermal engineers to ensure performance under harsh automotive conditions.
- Ensure ASIL-D compliance (ISO 26262) for safety-critical designs; participate in FMEA, FMEDA, and safety architecture reviews.
- Interface with camera, radar, LiDAR, and sensor fusion modules, ensuring signal quality, timing, and synchronization.
- Collaborate with PCB layout engineers for constraint-driven designs (impedance, stackup, crosstalk, EMI/EMC).
- Drive hardware validation and bring-up, including board-level testing, debugging, and root-cause analysis.
- Work with cross-functional teams (System, Software, Validation, Manufacturing, EMC) through design verification and PPAP stages.
- Support DFMEA, DFx (DFM, DFT, DFA) activities to ensure manufacturability and reliability.
- Create design documentation, validation reports, and participate in technical reviews and customer discussions.
- Required Skills and Experience:
- Bachelor’s or Master’s Degree in Electronics, Electrical, or related engineering field.
- 5-9 years of hands-on experience in automotive hardware design.
- Proven experience with SoC-based board design (e.g., NVIDIA, Qualcomm, Renesas, TI, NXP, Infineon AURIX).
- Strong understanding of ADAS, Cockpit, and IVI architecture including sensor and compute domains.
- Expertise in high-speed design (DDR4/5, PCIe, MIPI, Ethernet, USB 3.x, LVDS, SerDes).
- Experience with SI/PI analysis tools (e.g., HyperLynx, Sigrity, Ansys, Cadence). • Knowledge of Automotive Safety (ISO 26262 - ASIL B to D compliance).
- Familiarity with EMI/EMC standards (CISPR 25, ISO 11452) and compliance testing.
- Understanding of thermal design, power sequencing, and power distribution.
- Experience in camera/radar interface and sensor fusion hardware design.
- Proficiency in schematic tools (Altium, Cadence Allegro, Mentor DxDesigner, Zuken CR8000).
- Hands-on experience with hardware bring-up, debugging, and lab instruments (oscilloscope, logic analyzer, power analyzer, etc.).
- Excellent analytical, communication, and documentation skills.
- Preferred Qualifications: • Experience with ASIL-D compliant ECU development.
- Exposure to Ethernet TSN, CAN-FD, LIN, FlexRay and in-vehicle communication networks.
- Knowledge of thermal simulation and mechanical integration.
- Familiarity with AI/ML accelerator SoCs used in perception and fusion ECUs.
- Experience working with global OEMs and Tier-1s on production projects.
- Key Tools & Technologies: • Schematic/PCB: Zuken , Altium Designer, Cadence Allegro, Mentor Graphics
- Simulation: HyperLynx, Ansys SIwave, Sigrity, SPICE, ADS
- Compliance & Debug: Oscilloscope (≥20GHz), Vector CANoe, Power Analyzer, JTAG
- Documentation: PDM/PLM systems, Jira, Confluenc
B.E, Electronics Engineering
5 to 10 years
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