Electronic Hardware Engineering Lead/Manager

The Bosch Group is a leading global supplier of technology and services. Since the beginning of 2013, its operations have been divided into four business sectors: Automotive Technology, Industrial Technology, Consumer Goods, and Energy and Building Technology.

The Bosch Group comprises Robert Bosch GmbH and its roughly 360 subsidiaries and regional companies in some 50 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. This worldwide development, manufacturing, and sales network is the foundation for further growth.

Bosch Global Software Technologies Company Limited (BGSV) is 100% owned subsidiary of Robert Bosch GmbH - one of the world’s leading global suppliers of technology and services, offering end-to-end Engineering, IT, and Business Solutions.

Starting its operation from 2010 at Etown 2 in HCMC, BGSV is the first software development center of Bosch in Southeast Asia. BGSV nowadays have over 4,000 associates, with a global footprint and presence in the US, Europe, and the Asia Pacific region.

With our unique ability to offer end-to-end solutions that connect sensors, software, and services, we enable businesses to move from the traditional to digital or improve businesses by introducing a digital element in their products and processes.

We are seeking an experienced and hands-on Electronic Hardware Engineering Manager / Technical Lead to lead our hardware design team. In this role, you will drive the architecture, development, integration, and validation of next-generation high-performance electronic hardware platforms for automotive applications, particularly ADAS and infotainment systems.

The ideal candidate has extensive experience in high-speed board-level design, analytical engineering, simulation, and technical leadership. You will lead and develop a team of hardware design and PCB layout engineers while collaborating with global cross-functional teams and external development and manufacturing partners.

For additional project information, please refer to: https://www.bosch-semiconductors.com/stories-and-events/chiplet-revolution/

Key Responsibilities:

• Lead, mentor, and develop a high-performing team of hardware design and PCB layout engineers.
• Manage project schedules, resource allocation, technical deliverables, and dependencies throughout the product development lifecycle.
• Foster a culture of technical excellence, continuous learning, collaboration, and rigorous engineering practices.
• Define the hardware architecture and design complex multilayer, high-speed PCBs for automotive high-performance computing platforms.
• Oversee component selection, schematic design, PCB layout, and design reviews, ensuring compliance with applicable design guidelines and requirements.
• Develop hardware architectures supporting high-speed interfaces such as PCIe Gen 3/4/5, LPDDR5, USB 3.x, SGMII/RGMII, and 10G Automotive Ethernet.
• Develop and integrate high-performance computing systems based on advanced SoCs.
• Perform and review power-budget calculations, thermal analyses, and reliability assessments, including MTBF calculations.
• Lead and review Signal Integrity (SI) and Power Integrity (PI) simulations to address jitter, crosstalk, impedance, power-distribution, and voltage-drop issues.
• Lead root-cause analyses for complex hardware failures and implement robust corrective and preventive design measures.
• Serve as the primary technical contact for hardware-related topics and communicate complex concepts clearly to software, mechanical, system, manufacturing, and management stakeholders.
• Collaborate with original design manufacturers, electronics manufacturing service providers, component suppliers, and technology partners to support technology transfer and high-yield manufacturing.
• Ensure that designs consider manufacturability (DFM), testability, reliability (DFT), and applicable automotive requirements

Technical skills

• Bachelor’s or master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
• At least 10 years of experience in board-level electronic hardware development, including a minimum of 3 years in a technical leadership or engineering management role.
• Proven experience in delivering complex, high-speed computing platforms or products, such as automotive computing systems, servers, high-performance computing platforms, or carrier-grade network systems.
• Experience in automotive electronics development is highly desirable.
• Strong understanding of transmission-line theory, impedance control, PCB stack-up design, high-speed interface design, and EMI/EMC mitigation techniques.
• Proficiency in industry-standard electronic design automation tools, such as Cadence Allegro/OrCAD, Altium Designer, or Siemens EDA tools.
• Experience with SI/PI simulation tools, such as Ansys HFSS or SIwave, Cadence Sigrity, or Keysight ADS.
• Strong experience with laboratory validation using high-bandwidth oscilloscopes, bit-error-rate testers, vector network analyzers, and time-domain reflectometers.
• Practical experience with schematic reviews, PCB layout reviews, board bring-up, debugging, qualification, and design release.
• Knowledge of design for manufacturability and design for testability principles.

Soft skills

• Communication: Strong written and verbal English communication skills, with the ability to lead technical discussions and deliver clear presentations to technical and management stakeholders.
• Analytical thinking: Strong analytical and quantitative problem-solving skills, supported by a data-driven engineering approach.
• Leadership: Demonstrated ability to lead, mentor, and develop engineers while promoting ownership and technical excellence.
• Stakeholder management: Ability to influence cross-functional teams, align stakeholders, and manage technical conflicts effectively.
• Collaboration: Ability to work effectively with global teams, suppliers, development partners, and manufacturing organizations.

Further details regarding compensation and benefits will be shared during the interview process.