{"id":3155288,"url":"https://alion.io/job/boydcorp-junior-thermal-research-engineer","title":"Junior Thermal Research Engineer","company":{"id":721821,"name":"Boyd","domain":"boydcorp.com","url":"https://alion.io/company/boydcorp","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":26,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":null,"computed_at":"2026-11-01T06:10:25Z"}},"role":"AI/ML","role_family":"AI/ML","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"explicit","locations":["United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":99000,"max_usd":222000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":398},"experience_years_min":null,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"Machine Learning","optional":false},{"name":"MATLAB","optional":false},{"name":"Python","optional":false},{"name":"SolidWorks","optional":false}],"status":"live","first_seen_at":"2026-08-26T00:00:00Z","employer_posted_date":"2026-08-26","last_verified_at":"2026-11-01T02:19:21Z","board_verified":true,"closed_at":null,"days_open":67,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":67},"description":"Job Description\nThe Junior Thermal Research Engineer will work within a multidisciplinary engineering team to develop innovative thermal management and test solutions for high-performance electronics and data center systems. The role combines thermal system design, modeling, experimentation, and data science techniques, with a focus on enabling faster design cycles and improved system-level insight.\nPrimary Responsibilities:\nSupport the design and development of thermal management systems, including liquid cooling, two-phase cooling, and heat exchanger-based architectures\nCooling system design including cold plates, cooling distribution units (CDUs) and passive two-phase solutions (heat pipes and vapor chambers)\nDevelop and apply thermal-fluid modeling tools (steady-state and transient) for system-level performance prediction, including pressure drop, heat transfer, and coolant distribution\nImplement and use machine learning, AI and data-driven methods\nSupport data center cooling system modeling, including rack-level and component-level thermal architecture analysis\nConduct design of experiments (DOE) and support experimental testing, including instrumentation, data acquisition, and validation of models\nCreate and maintain CAD models and engineering documentation (e.g., SolidWorks designs, P&IDs, drawings, and test plans)\nAssist in development of computational tools and simulation frameworks (Python, MATLAB) to support engineering decision-making and research activities\nSupport prototype development and testbed construction, including integration of thermal systems and measurement capabilities\nCollaborate with senior engineers and researchers to:Evaluate new cooling technologies\nImprove system efficiency and performance\nIdentify key design tradeoffs\n\nContribute to technical documentation, reports, and presentations of results\nSupport component and material selection for thermal systems (heat exchangers, sensors, cooling loops)\nAssist in manufacturing and assembly support, including prototype builds and testing\nBasic Qualifications\nMaster’s or PhD degree in Mechanical Engineering or related field\nEaton will not consider applicants for employment immigration sponsorship or support for this position. This means that Eaton will not support any CPT, OPT, or STEM OPT plans, F-1 to H-1B, H-1B cap registration, O-1, E-3, TN status, I-485 job portability, etc.\nRelocation may be offered for the role, must be currently located in the United States.\nPreferred Experience:\nExposure to data center cooling or high-performance electronics thermal management\nExperience developing reduced-order or surrogate models for thermal systems\nFamiliarity with optimization-driven design workflows\nExperience integrating modeling and experimental validation\nFocus or coursework in heat transfer, fluid dynamics, or thermal systems required\nLaboratory experience\nGraduate research experience in thermal-fluid sciences or cooling technologies strongly preferred\nAll Job Posting Locations\nFredericksburg\nRemote Type\nOn-SiteEEO Statement\nBoyd Corpis an equal opportunity employer. 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