{"id":4198728,"url":"https://alion.io/job/broadcom-failure-analysis-engineer","title":"Failure Analysis Engineer","company":{"id":95,"name":"Broadcom","domain":"broadcom.com","url":"https://alion.io/company/broadcom","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":63,"ghost_share":0.032,"stale_share":0.556,"repost_share":0.032,"time_to_fill_p50_days":37,"computed_at":"2026-11-12T10:38:37Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Fort Collins, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":109700,"max":175500,"currency":"USD","period":"year","gross":null,"usd_annual":175500},"salary_estimate":null,"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"SDL","optional":false},{"name":"C","optional":true}],"status":"live","first_seen_at":"2026-11-12T21:21:47Z","employer_posted_date":"2026-11-12","last_verified_at":"2026-11-12T21:21:47Z","board_verified":true,"closed_at":null,"days_open":0,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":0},"description":"Please Note:\n1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)\n2. If you already have a Candidate Account, please Sign-In before you apply.\nJob Description:\nBroadcom is seeking a highly motivated and results-driven Failure Analysis Engineer to ensure successful deployment of Broadcom's most advanced products, including industry-leading AI accelerators and high-speed networking solutions. This hands-on, technical position requires ownership of the complete failure analysis lifecycle, from initial fault isolation to physical identification and nanoscale characterization, and findings are used to drive corrective action with design, process, product, and packaging teams across advanced silicon (e.g., FinFET, GAA) and cutting-edge packaging technologies (e.g., 2.5D, CoWoS-S/L, 3DIC, CoPoS, CPO).\nResponsibilities:\nOwn full-flow FA on advanced-node logic and mixed-signal devices and advanced packages.\nEngage in team-based culture through open communication, continuous improvement, and willingness to assist others.\nPlan and execute individual FA plans through background data collection, ATE datalog interpretation, and non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace). \nApply fault isolation techniques, including photon emission (PEM/EMMI), laser-based (LADA/SDL/OBIRCH), thermal, and lock-in methods, to localize defects in front-side and backside configurations.\nPerform nanoprobing (SEM-based) for BEOL and FEOL electrical characterization and defect isolation (EBAC, EBIRCH, EBIC).\nExecute sample preparation and physical analysis: physical deprocessing of ICs and packages (mechanical, chemical, PFIB), backside thinning, cross-section SEM/TEM, elemental analysis (EDS).\nCorrelate design-based FA results (scan diagnosis, memory bitmapping) and ATPG/DFT results with physical localization to drive root cause on resistive and systematic defects.\nCollaborate with global cross-functional teams to identify root causes of failures from various stages of the product lifecycle (e.g., design, prototype, reliability, RMA, yield). \nCommunicate complex FA findings effectively (written and verbal), enabling data-driven corrective actions to resolve critical quality issues.\nDevelop and implement new FA methodologies and procedures unique to advanced silicon & packaging technologies to enhance efficiency and effectiveness.\nRequired Qualifications:\nPlease apply only if you meet all of the following:\nBS, MS, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field. \n8+ years of hands-on semiconductor failure analysis experience, with a demonstrated history of root-causing failures at 16nm or below and/or in 2.5D packages. \nFull-flow FA experience: electrical verification, non-destructive analysis, backside fault isolation on flip-chip and/or 3D devices, deprocessing, physical analysis, and technical report writing \nExtensive hands-on expertise in fault isolation and/or nanoprobing, including tool operation, data interpretation, and the ability to choose appropriate EFA/PFA analysis techniques based on the failure signature.\nHighly Desired Qualifications:\nStrong understanding of semiconductor device physics, fabrication processes, and packaging technologies.\nExperience with Experience with 3DICs, CoWoS-L, CoPoS, co-packaged optics/copper (CPO/CPC).\nExperience with high-speed digital and mixed-signal failure analysis.\nExpertise in design-based FA (scan and memory diagnostics).\nFA-specific ATE test flow generation, pattern modification, and hardware. \nExcellent problem-solving skills and a methodical approach to root cause analysis.\nAbility to work independently and as part of a team. \nBroad interests, self-driven, and a lifelong learner.\nManage multiple root cause projects in parallel in a fast-paced environment.\nCompensation and Benefits\nThe annual base salary range for this position is USD 109,700.00 To USD 175,500.00\nAs a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.\nBroadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.\nBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.\nIf you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.","description_format":"text","description_chars":5278,"description_truncated":false,"requirements":{"experience_years_min":8,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":["Equity","Parental leave"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["RF & Wireless Hardware","Virtualization & Containers","Network Equipment","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-11-12T21:21:47Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 101 · green card filings: 23","filings_12m":101,"filings_prev_12m":80,"green_card_filings_12m":23,"median_offered_wage_usd":173427,"route":null,"cap_exempt":false,"checked_at":"2026-11-12T07:36:15+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":86,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.86,"p_room":1,"age_days":0,"expected_fill_days":37,"reasons":["conf:0","win:early","comp:brand"],"computed_at":"2026-11-12T21:59:40Z"},"pay":{"stated_usd_annual":175500,"is_top_pay":true},"html_url":"https://alion.io/job/broadcom-failure-analysis-engineer","json_url":"https://alion.io/job/broadcom-failure-analysis-engineer.json","meta":{"generated_at":"2026-11-12T21:59:40Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":46425,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-13T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.1,"usd":0.01,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":95},"rest":"https://alion.io/mcp/rest/get_company?id=95"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fbroadcom-failure-analysis-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"free","price":{"credits":0,"usd":0},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fbroadcom-failure-analysis-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.1,"usd":0.01},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fbroadcom-failure-analysis-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/broadcom-failure-analysis-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fbroadcom-failure-analysis-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":4198728}},{"tool":"search_jobs","arguments":{"company":"broadcom.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":4198728},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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