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Salary
$110k – $176k per year
Location
In office (Fort Collins)
Employment
Full-Time
Overview
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Impact
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Broadcom is an American semiconductor and infrastructure software company headquartered in Palo Alto, California, whose chip lineage runs back through Avago to the Hewlett-Packard components division. It designs networking switch and routing silicon that carries a large share of data centre traffic, custom AI accelerators built for hyperscale customers, plus wireless, broadband, storage and optical components. A sequence of very large acquisitions, culminating in the sixty-nine billion dollar purchase of VMware in 2023, has made infrastructure software roughly as important as chips to the group, and it is one of the most valuable listed technology companies in the world.

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Job Description:

Description

As a Photolithography Engineer with the Wireless Semiconductor Division (WSD), you will develop and sustain new and enabling unit processes in our existing high volume Si MEMS production facilities located along the Front Range Mountains in Northern Colorado. You will team with Technology Development and Equipment Engineering to achieve this objective. The team will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping them into high volume manufacturing. We are looking to hire a talented, highly motivated engineer responsible for challenging and rewarding work.

Responsibilities:

  • Development and characterization of robust solutions to R&D needs in collaboration with development engineering groups.

  • Combination of layer and process tool ownership. Responsible for managing CD and overlay SPC charts, along with layer defect monitoring.

  • Ownership of photo processes on ASML i-line steppers and high-topography exposure systems for MEMS Silicon based technologies. This will include sustaining high volume manufacturing lines, as well as some new processes, materials, and applications development.

  • Yield, quality and cost improvements to existing unit processes, to deliver highly robust and consistent results in collaboration with equipment maintenance and operational organizations.

  • Collaborate with Equipment Engineering and R&D to conceptualize and progress opportunities that enable continued technological leadership, working across roles & teams, both internal and external, to deliver benefit to the business.

  • Experimental design and data analysis to support the line sustaining work, process development and process improvements. Solid identification and resolution of yield and defect issues with clear communication of results across the organization.

  • Organizes and manages long-term improvement projects to meet organizational goals. Work with peers and the equipment engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects.

  • Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).

Qualifications:

  • BS (MS or higher preferred) in EE, ME, ChE, Materials Science, Physics or Chemistry and 8+ years of related experience. Or MS in EE, ME, ChE, Material Sciences, Physics or Chemistry and 6+ years related experience. Or PhD in EE, ME, ChE, Material Sciences, Physics or Chemistry and 3+ years of related experience

  • Expertise in photolithography, this position designed for highly autonomous experts. This is not an entry level position.

  • Proficiency in a wide variety of photolithography tools. Experience with TEL_ACT8 and PAS5500 equipment is highly desirable. Experience with Wafer-Level Packaging (WLP), through silicon vias (TSVs), or thick resist processing (e.g. polyimides, chem amp resists, etc.) is desirable

    • Exposure Focus: Deep experience with ASML equipment (PAS5500), advanced process control, overlay optimization, and i-line steppers.

    • Track Focus: Deep track background (TEL_ACT8) focused on R&D, new layer development, and new resist materials selection.

  • Expertise in engineering fundamentals for all areas of fab processing

  • Understanding of general processing techniques and concepts for silicon-based MEMS devices applications including interdependencies with other unit processes.

  • Strength in Statistical Process Control for a high-volume manufacturing facility. Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access is required.

  • Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.

  • Proven ability to work in a dynamic environment and deliver results.

  • Strong troubleshooting skills.

  • Excellent ownership, initiative and communication skills.

  • Track record of self-motivated and collaborative learning.

  • Ability to prioritize and multitask.

  • Strong cross functional teamwork skills and demonstrated ability to deliver improvements within a team environment.

  • Attention to detail is essential.

  • Legal authorization to work in the U.S. is required.

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $109,700 - $175,500

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

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