{"id":3377873,"url":"https://alion.io/job/broadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization","title":"R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization","company":{"id":95,"name":"Broadcom","domain":"broadcom.com","url":"https://alion.io/company/broadcom","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":86,"open_postings":66,"ghost_share":0.015,"stale_share":0.515,"repost_share":0.015,"time_to_fill_p50_days":35,"computed_at":"2026-11-02T06:13:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Regensburg, Germany"],"countries":["DE"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":56000,"max_usd":91000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":20},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Advantest / Teradyne ATE","optional":true},{"name":"C#","optional":true},{"name":"C++","optional":true},{"name":"Java","optional":true},{"name":"MATLAB","optional":true},{"name":"Python","optional":true}],"status":"live","first_seen_at":"2026-10-27T00:00:00Z","employer_posted_date":"2026-10-27","last_verified_at":"2026-11-02T07:41:27Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"Please Note:\n1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)\n2. If you already have a Candidate Account, please Sign-In before you apply.\nJob Description:\nDevelopment of device testing at wafer level, die level and module level\nMore specific duties include the following:\nDefinition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products.\nDevelopment, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners.\nDesign of test application PCBs, test sockets, probe cards.\nHandover of test solutions to the production site or to external test houses.\nFull characterization of the devices over corner conditions, according to specification.\nEvaluation, analysis and reporting of characterization results and production test results along with creation of respective reports.\nClose cooperation with IC-designers, product-designers and project leaders throughout the entire project phase.\nOptimization of productive test packages (wafer level or final module test) based on the analysis of characterization and test data in order to achieve cost-efficient test solutions.\nRequired qualifications:\nMaster’s Degree or PhD in Electrical Engineering, Physics or equivalent discipline with focus on semiconductor devices and/or electrical/optical testing and measurement technology.\n3+ years of experience in semiconductor testing.\nDesired skills and expertise:\nDeep technical expertise in the area of testing and measurement technology as well as data analysis techniques.\nExperience with discrete test/measurement equipment (oscilloscope, SMU, spectrum analyzer, etc.). Ideally also familiar with ATE equipment from well-known manufacturers (e.g. Teradyne, Advantest, LTX, etc.).\nGood knowledge of wafer probers and different probe card technologies.\nProfound expertise of structured programming using common languages, e.g. Python, C++, LabVIEW, NI TestStand, Python, C#, Java, MATLAB or similar software and maybe special ATE programming languages.\nExperience using AI tools to support the execution of the tasks described above.\nGood technical background in semiconductors.\nBoth a self-contained, accurate approach to work and a broad interest in interdisciplinary work at the interface of electronics, optics, fiber technology and communication systems.\nProject experience and ability to integrate into teams across different functions and locations.\nGeneral Requirements:\nSpoken and written proficiency in English. Prepared to learn German and acquire German communication skills.\nOpenness to new technical fields and a motivation to familiarize oneself with them.\nInterface to customers as well as to suppliers, travel requirement up to 20% of the time, depending on project requirements. Need to be a good team player.\nBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.\nIf you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.","description_format":"text","description_chars":3670,"description_truncated":false,"requirements":{"experience_years_min":3,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[{"language":"German","level":"Upper-Intermediate (B2)","optional":false},{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["RF & Wireless Hardware","Virtualization & Containers","Network Equipment","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-28T03:32:07Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":6,"expected_fill_days":35,"reasons":["conf:9","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-11-02T06:13:15Z"},"pay":null,"html_url":"https://alion.io/job/broadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization","json_url":"https://alion.io/job/broadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization.json","meta":{"generated_at":"2026-11-02T09:47:17Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":13640,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-03T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":95},"rest":"https://alion.io/mcp/rest/get_company?id=95"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fbroadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fbroadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fbroadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/broadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fbroadcom-rd-engineer-test-engineering-wafer-test-final-module-test-characterization"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3377873}},{"tool":"search_jobs","arguments":{"company":"broadcom.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3377873},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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