{"id":2642438,"url":"https://alion.io/job/broadcom-substrate-engineer","title":"Substrate Engineer","company":{"id":95,"name":"Broadcom","domain":"broadcom.com","url":"https://alion.io/company/broadcom","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":89,"open_postings":70,"ghost_share":0,"stale_share":0.457,"repost_share":0,"time_to_fill_p50_days":34,"computed_at":"2026-10-24T06:02:35Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hsinchu, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":16500,"max_usd":38000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":7932},"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-14T00:00:00Z","employer_posted_date":"2026-10-14","last_verified_at":"2026-10-23T11:07:28Z","board_verified":true,"closed_at":null,"days_open":11,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":11},"description":"Please Note:\n1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)\n2. If you already have a Candidate Account, please Sign-In before you apply.\nJob Description:\nJD:\nResponsible for working with Broadcom's IC substrate subcontractors to manage and resolve issues relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices.\nResponsible for NPI activity, risk assessments, process improvement & development and production engineering support of high volume IC substrate manufacturing.\nWork with Broadcom internal cross functional engineering teams resolve issues with interactive nature; work on newly developed packaging technology and drive towards high volume manufacturing maturity\nResponsible for new product pre-production engineering activity and drive improvements in process and visual mechanical yields, cycle time.\nTake on site to site standardizations in Best Known Methods, and verification on compliance towards Broadcom requirements\nDrive capability enhancement and cost reduction projects\nQualification of new suppliers / new site and support moving to HVM\nJR:\nBachelor Degree in an engineering discipline (Mechanical, Manufacturing, Material Science, Chemical or Electrical).\n8 years' experience in IC substrate manufacturing technologies and processes.\nDirect process and operational experience in a substrate manufacturing operations line is required.\nExpertise in ABF substrate interactions with Ball Grid Arrays, flipchip; laminate substrates interactions with die attach, wirebonding, molding, flipchip attach, singulation, packaging materials is required.\nTrack record of good achievements managing substrate technical specifications that impact the downstream margins of assembly processing.\nDirect process and operational experience in manufacturing environment\nExperience in component quality interactions with SMT processibility is not a pre-requisite, but will be favorable\nProven ability to manage and coordinate complex activities across multiple groups including operations, quality, business units, suppliers, marketing, customers.\nExperience with managing activities with packaging subcontractors and driving resolution of manufacturing issues. Demonstrate leadership in working within different internal functional groups to manage issue containment and drive the best path forward.\nThorough knowledge of problem solving methodologies and failure analysis techniques. Must demonstrate the ability to quickly make assessments of risks and take the necessary steps in managing escalations. Demonstrate good communication skills in problem resolution.\nHave a very good command on spoken and written English, Fluent in Mandarin\nWilling to travel throughout Asia to support manufacturing locations.\nBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.\nIf you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.","description_format":"text","description_chars":3420,"description_truncated":false,"requirements":{"experience_years_min":8,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["RF & Wireless Hardware","Virtualization & Containers","Network Equipment","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-15T19:13:53Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.898,"p_room":1,"age_days":10,"expected_fill_days":34,"reasons":["conf:18","velocity","win:early","comp:brand"],"computed_at":"2026-10-24T06:02:35Z"},"pay":null,"html_url":"https://alion.io/job/broadcom-substrate-engineer","json_url":"https://alion.io/job/broadcom-substrate-engineer.json","meta":{"generated_at":"2026-10-25T04:34:28Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":6050,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-26T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":95},"rest":"https://alion.io/mcp/rest/get_company?id=95"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fbroadcom-substrate-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fbroadcom-substrate-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fbroadcom-substrate-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/broadcom-substrate-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fbroadcom-substrate-engineer"}]}