{"id":2864834,"url":"https://alion.io/job/broadcom-wafer-fab-process-engineer-2","title":"Wafer Fab Process Engineer","company":{"id":95,"name":"Broadcom","domain":"broadcom.com","url":"https://alion.io/company/broadcom","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":89,"open_postings":70,"ghost_share":0,"stale_share":0.457,"repost_share":0,"time_to_fill_p50_days":34,"computed_at":"2026-10-24T06:02:35Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":37000,"max_usd":73000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":358},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-07-22T00:00:00Z","employer_posted_date":"2026-07-22","last_verified_at":"2026-10-23T11:07:28Z","board_verified":true,"closed_at":null,"days_open":94,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":94},"description":"Please Note:\n1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)\n2. If you already have a Candidate Account, please Sign-In before you apply.\nJob Description:\nJobSummary\nLead process development, optimization, and transfer to manufacturing to achieve yield, quality, cost, and reliability targets.\nKey Responsibilities\nOwn and drive advanced process modules (thin film deposition - metal/passivation, wafer thinning, thermal - oxidation, diffusion, implantation).\n\nLead yield improvement and defect reduction initiatives using statistical and DOE methodologies.\n\nDrive new process integration (NPI) and process transfer to high-volume manufacturing.\n\nPerform root cause analysis and implement robust corrective/preventive actions.\n\nDefine process control plans, SPC strategies, and OCAP execution.\n\nCollaborate cross-functionally with equipment, integration, quality, and R&D teams.\n\nMentor junior engineers and technicians.\n\nInterface with suppliers on process and material improvements.\n\nQualifications\nBachelor’s or Master’s degree in Engineering (Electrical, Chemical, Materials, or related).\n\nAt least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).\n\nStrong knowledge of SPC, DOE, FMEA, and statistical data analysis tools.\n\nDemonstrated leadership in cross-functional technical projects.\n\nStrong analytical, problem-solving, and communication skills\n\nPreferred\nPhD in Engineering (Electrical, Chemical, Materials, or related).\n\nSix Sigma certification (Green/Black Belt).\n\nExperience supporting 4\" to 6\" wafer scaling or equivalent manufacturing transition.\n\nBroadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. 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