{"id":3231262,"url":"https://alion.io/job/cadence-design-systems-solutions-engineer-ae","title":"Solutions Engineer - AE","company":{"id":4351,"name":"Cadence Design Systems","domain":"cadence.com","url":"https://alion.io/company/cadence","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":82,"open_postings":115,"ghost_share":0,"stale_share":0.73,"repost_share":0,"time_to_fill_p50_days":57,"computed_at":"2026-10-26T05:57:25Z"}},"role":"Solutions","role_family":"Solutions","seniority":"staff","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":162400,"max":301600,"currency":"USD","period":"year","gross":null,"usd_annual":301600},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":true,"technologies":[{"name":"HPC","optional":false},{"name":"Cadence Allegro","optional":true},{"name":"Cadence Clarity 3D Solver","optional":true},{"name":"Cadence Integrity 3D-IC","optional":true},{"name":"Cadence Sigrity","optional":true}],"status":"live","first_seen_at":"2026-10-22T00:00:00Z","employer_posted_date":"2026-10-22","last_verified_at":"2026-10-25T13:14:13Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.\nSolutions Architect Engineer (AE)\nAdvanced Packaging, 3D-IC and SI/PI\nLocation\nUnited States (Remote or Hybrid)\nJob Summary\nCadence is seeking a highly motivated and experienced Solutions Application Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, chiplet-based architectures, AI/HPC packages, and heterogeneous integration technologies.\nThe successful candidate will work directly with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package 3D-IC associated design flows. This role combines technical expertise, customer engagement, solution development, and collaboration with R&D to drive customer success and product adoption.\nResponsibilities\nProvide technical leadership and application support for Cadence 3D-IC design solutions.\nAssist customers with advanced package architecture, design implementation, and methodology development.\nDevelop and demonstrate complete packaging workflows for:Organic substrates\nSilicon interposers\nWafer Level Packaging\n2.5D and 3D-IC integration\nChiplet-based package architectures\n\nSupport customer evaluations, proof-of-concepts, benchmarks, and production deployments.\nDeliver technical presentations, product demonstrations, workshops, and training sessions.\nCollaborate with sales teams to identify opportunities and provide technical pre-sales support.\nWork closely with R&D to communicate customer requirements, enhancement requests, and new technology needs.\nSupport design-signoff methodologies including:DRC/LVS\nConnectivity verification\nElectrical rule checking\nThermal analysis\nSignal Integrity (SI)\nPower Integrity (PI)\n\nDevelop best practices, application notes, reference flows, and customer success methodologies.\nAssist in defining future product direction for advanced packaging, 3D-IC, and chiplet technologies.\nRequired Qualifications\nBachelor’s degree (Masters preferred) in Electrical or Electronics Engineering, or related discipline with\n10+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design.\nStrong knowledge of:Advanced package design methodologies\n2.5D and 3D-IC integration\nChiplet-based architectures\nPackage manufacturing and assembly processes\nHigh-speed signal design\nPower delivery networks\n\nExperience performing package layout, routing, constraint management, and package signoff.\nSolid understanding of package stackups, bump planning, escape routing, and substrate technologies.\nExcellent customer-facing communication and presentation skills.\nAbility to work independently while collaborating across global teams.\nPreferred Qualifications\nExperience with Cadence Integrity 3D-IC Platform.\nExperience with Cadence Sigrity and Clarity 3D Solver.\nHands-on experience with Cadence Allegro X APD.\nKnowledge of UCIe, HBM, AI accelerator packaging, and heterogeneous integration.\nExperience supporting foundry and OSAT design flows.\nUnderstanding of semiconductor assembly, reliability, and manufacturing processes.\nTravel Expectations: Approximately 2% to 5% travel, depending on customer demand and business needs.\nThe annual salary range for California is $162,400 to $301,600. You may also be eligible to receive incentive compensation: bonus, equity, and benefits. Sales positions generally offer a competitive On Target Earnings (OTE) incentive compensation structure. Please note that the salary range is a guideline and compensation may vary based on factors such as qualifications, skill level, competencies and work location. Our benefits programs include: paid vacation and paid holidays, 401(k) plan with employer match, employee stock purchase plan, a variety of medical, dental and vision plan options, and more.\nWe’re doing work that matters. Help us solve what others can’t.","description_format":"text","description_chars":3948,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":["Equity"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["EDA Software","Semiconductor IP & Chip Design Services"],"lifecycle":[{"event":"open","at":"2026-10-25T08:33:07Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 368 · green card filings: 176","filings_12m":368,"filings_prev_12m":268,"green_card_filings_12m":176,"median_offered_wage_usd":150882,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":61}],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":4,"expected_fill_days":57,"reasons":["conf:16","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-26T05:57:25Z"},"pay":{"stated_usd_annual":301600,"is_top_pay":true},"html_url":"https://alion.io/job/cadence-design-systems-solutions-engineer-ae","json_url":"https://alion.io/job/cadence-design-systems-solutions-engineer-ae.json","meta":{"generated_at":"2026-10-26T21:24:11Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":28865,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-27T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":4351},"rest":"https://alion.io/mcp/rest/get_company?id=4351"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fcadence-design-systems-solutions-engineer-ae"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fcadence-design-systems-solutions-engineer-ae"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fcadence-design-systems-solutions-engineer-ae"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/cadence-design-systems-solutions-engineer-ae\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fcadence-design-systems-solutions-engineer-ae"}]}