Mechanical Design Engineer

Ceragon Networks • English • Telecommunications • RF & Wireless Hardware • 3 days ago
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Salary
≈ $13k – $36k per year (Estimated)
Location
Hybrid (Bengaluru, India)
Seniority
Senior · 5+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 15, 2026. First seen by Alion on Oct 13, 2026.

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Ceragon Networks

Founded in 1996, Ceragon Networks is a global telecommunications company specializing in high-capacity wireless transport and backhaul solutions. Headquartered in Tel Aviv, Israel, the company designs advanced microwave and millimeter-wave systems that enable seamless data transmission for 4G and 5G mobile networks. Its hardware platforms and managed network services are deployed by hundreds of cellular service providers, public safety agencies, and industrial enterprises across more than 130 countries.
ceragon.com • HQ: Tel Aviv, Israel • Hardware • Telecommunications • Telecom Infrastructure • RF & Wireless Hardware • 51-200 employees • Est. 1996
Tech stack of Ceragon Networks

Description

Ceragon is the global innovator and leading solutions provider of end-to-end wireless connectivity, specializing in transport, access, and AI-powered managed & professional services. Through our commitment to excellence, we empower customers to elevate operational efficiency and enrich the quality of experience for their end users.

Our customers include service providers, utilities, public safety organizations, government agencies, energy companies, and more, who rely on our wireless expertise and cutting-edge solutions for 5G & 4G broadband wireless connectivity, mission-critical services, and an array of applications that harness our ultra-high reliability and speed.

Ceragon solutions are deployed by more than 600 service providers and over 1,600 private network owners across more than 130 countries.

Through our innovative end-to-end portfolio spanning hardware, software, managed services, and professional services, Ceragon enables customers to embrace the future of wireless technology with confidence while delivering reliable, high-capacity, and cost-effective connectivity solutions worldwide.

  • Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming
  • Experience in electronic packaging design
  • Experience in Electro Mechanical Integration
  • Experience in leading full life cycle projects
  • Experience with PLM systems, engineering changes, BOM structuring, etc.
  • Experience in design of indoor and outdoor equipment
  • Experience in thermal, dynamical and statical design and analysis
  • Experience in design of telecommunication/RF equipment - an advantage
  • Experience in mentoring engineers - an advantage
  • Perform analysis, testing, design iterations, and validation of the designs

Requirements

  • Qualification: BE in Mechanical Engineering from an accredited university. ME an advantage
  • At least 5 years of experience in electronics packaging design
  • Strong understanding of GD&T, drawings, assembly tolerances - must
  • Proficiency in SolidWorks - must
  • Proficiency in writing as well as speaking in English
  • Must be self-motivated, able to work under pressure, and multitask
  • Team player with strong technical and communication skills
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