{"id":1621811,"url":"https://alion.io/job/cirrus-logic-staff-package-design-engineer","title":"Staff Package Design Engineer","company":{"id":449717,"name":"Cirrus Logic","domain":"cirrus.com","url":"https://alion.io/company/cirrus-logic","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Lever","truth_index":{"grade":"B","score":77,"open_postings":112,"ghost_share":0.295,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":63,"computed_at":"2026-10-19T05:45:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Austin, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":138000,"max_usd":249000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":492},"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AutoCAD","optional":false},{"name":"Cadence Allegro","optional":true},{"name":"Cadence Virtuoso","optional":true},{"name":"Mentor Xpedition","optional":true},{"name":"Siemens Calibre","optional":true}],"status":"live","first_seen_at":"2026-05-12T14:01:33Z","employer_posted_date":"2026-05-12","last_verified_at":"2026-10-20T03:03:36Z","board_verified":true,"closed_at":null,"days_open":160,"trust":{"level":"ok","repost_count":0,"flags":["company_stale"],"days_open":159},"description":"Are you ready to make a significant impact in a fast-paced, innovative environment?\nWe are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you’ll work closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire-bond QFN to advanced WLCSP and flip-chip designs.\nThis is a challenging design/layout position in a high volume, dynamic and fast paced environment, and will have a direct impact on business with external customers by helping create innovation that rocks. Products include top of the line Amps, Codecs and DSPs to name a few. The package design types are a wide variety from WLCSP to wirebond to flip chip. This is a chance to be part of a package design team supporting challenging customer expectations and a growing business.\nKey Responsibilities\n· Design package layouts, stack-ups, drawings, models, simulations, and design documentation to verify compliance with requirements and design standards\n· Work tightly with Global Design (UK and US) I.C. and board teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements\n· Interface with cross functional teams (Design, Layout) to define package requirements from electrical, thermal, and mechanical point of view\n· Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation, and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information\n· Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB\n· Collaborate with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages\n· Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues\n· Grow and promote automation processes throughout the package design flow\n· Close collaboration with customers to resolve various design issues between the piece part and PCB\nRequired Skills and Qualifications\n· B.S. or higher degree in Mechanical or Electrical Engineering\n· 5+ year's experience designing for manufacturability\n· Experienced Cadence SiP layout user\n· Strong AutoCAD user\n· Knowledge of packaging technologies, materials, package substrate design, and assembly rules\n· Understanding of electrical simulation results on a package design\nPreferred Skills and Qualifications\n· Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)\n· Broad reading in the area of interest and the desire to continue that reading with access to the high-quality company library resources, material properties knowledge\n· Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self-learning or training opportunities available through company resources\n· Electrical simulation skills\n· Experience using Siemens Fast 3D\n· Experience using Siemens Calibre DRV","description_format":"text","description_chars":3210,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":null,"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":[],"lifecycle":[{"event":"open","at":"2026-10-01T20:48:18Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 4 · green 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