{"id":1127310,"url":"https://alion.io/job/commonwealth-fusion-systems-rf-electronics-engineer","title":"RF Electronics Engineer","company":{"id":8705,"name":"Commonwealth Fusion Systems","domain":"cfs.energy","url":"https://alion.io/company/commonwealth-fusion-systems","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Lever","truth_index":{"grade":"B","score":80,"open_postings":5,"ghost_share":0,"stale_share":0.8,"repost_share":0,"time_to_fill_p50_days":50,"computed_at":"2026-11-09T06:03:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Devens, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":107000,"max":160000,"currency":"USD","period":"year","gross":null,"usd_annual":160000},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-22T21:38:19Z","employer_posted_date":"2026-09-22","last_verified_at":"2026-11-10T01:46:05Z","board_verified":true,"closed_at":null,"days_open":48,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":48},"description":"Join the power movement as an RF Electronics Engineer\nSPARC sustains fusion reactions by feeding >25MW of 120MHz RF power into the tokamak to heat the plasma to 100 million Kelvin. We need an RF Test Engineer to play a pivotal role in validating and testing the electronics and control systems that power the most ambitious RF plant in the world.\nAt this level, you are a hands-on executor and technical problem solver. You will be directly responsible for taking newly architected RF and power electronics from the benchtop to full-scale operation. Your day-to-day will span board-level bring-up, operating high-power RF transmitters, and integrating hardware with software controls to ensure SPARC achieves net energy.\nFor more information on the SPARC RF plant, see the SPARC journal papers here:\nOverview of the SPARC tokamak\n Physics basis for the ICRF system of the SPARC tokamak\nWhat you'll do:\nArchitect and design custom control boards, precision power supplies, and sensing circuits required to drive distributed, high-power solid-state RF amplifiers\nPartner closely with cross-functional teams, including software, RF, mechanical, and manufacturing engineers, to ensure your custom electronic designs integrate seamlessly into the broader system architecture\nWrite comprehensive technical specifications for external vendors and internal matrix support teams to ensure manufactured components meet stringent requirements\nPerform advanced simulation and modeling of electronic circuits and power systems to validate performance\nPhysically assemble and bring up initial prototypes on the bench, ensuring your designs transition flawlessly into the integrated RF system\nWhat we’re looking for:\nBachelor’s degree in Electrical Engineering or a related field\n5+ years of hands-on experience designing power electronics, control boards, or RF support circuitry\nHands-on experience using circuit simulation software (e.g., SPICE) to model and validate circuit designs\nExceptional PCB design skills utilizing Altium or similar software, specifically geared toward instrumentation, sensing, power supplies, and control systems\nHigh proficiency in modeling tools to validate electronics architecture and mitigate EMI/EMC issues in high-power, high-noise environments\nBonus points for:\nExperience working with high voltage systems and in high voltage environments\nBackground in requirements engineering, specifically decomposing high-level system requirements into actionable hardware specifications\nDirect experience working with RF systems, with a strong bonus for candidates who have worked on high-power RF heating systems\nExperience with thermal management techniques for densely packed, high-power printed circuit board assemblies\nExperience translating complex engineering needs into clear manufacturing specifications for contract manufacturers and cross-functional teams\nA strong systems-level understanding of modern high-performance embedded digital controllers and high-speed communications\nMust-have Requirements:\nAbility to lift up to 50lbs\nPerform activities such as stooping, climbing, standing, typing or sitting for extended periods of time\nWillingness to travel or work required nights/weekends/on-call occasionally\nWork in a facility that contains industrial hazards including heat, cold, noise, fumes, strong magnets, lead (Pb), high voltage, high current, pressure systems, and 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