{"id":768368,"url":"https://alion.io/job/delosdata-package-engineer","title":"Packaging Engineer","company":{"id":673877,"name":"Delos Data","domain":"delosdata.com","url":"https://alion.io/company/delosdata","size_band":null,"is_staffing_agency":false,"is_intermediary":false,"ats_vendor":"Ashby","truth_index":{"grade":"B","score":75,"open_postings":3,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":null,"computed_at":"2026-09-23T05:45:00Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":null,"employment_type":"full_time","work_mode":"on_site","remote_scope":null,"hiring_geo_confidence":"structured","locations":["Palo Alto, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":180000,"max":240000,"currency":"USD","period":"year","gross":null,"usd_annual":240000},"salary_estimate":null,"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Cadence Sigrity","optional":false}],"status":"live","first_seen_at":"2026-06-11T16:49:54Z","employer_posted_date":"2026-06-11","last_verified_at":"2026-09-24T02:42:37Z","board_verified":true,"closed_at":null,"days_open":104,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":103},"description":"Who We Are\nWe are a startup building foundational technology to address performance, scalability, and resiliency challenges in large-scale AI data center clusters. We are backed by top-tier VC firms and notable angel investors. The company is led by experienced builders and operators who have founded companies, taken them to scale, and exited successfully. We work with a strong sense of unity and shared responsibility, and we expect trust, integrity, and respect in how we collaborate and make decisions. We hold ourselves accountable to one another and to the quality of the work we deliver. Headquartered in Silicon Valley, we operate across a mix of remote and on-site locations in the U.S. and Canada. We aim to create an environment where people are treated fairly, supported in their growth, and are empowered to do meaningful work alongside others who take the craft seriously.\nSome Recent Press:https://www.eetimes.com/startup-boosts-scale-up-to-1000-gpus-in-a-single-domain/\nWhat We Need\nA Senior Packaging Engineer responsible for architecting and delivering advanced multi-die IC packages for high-performance AI accelerators. This role focuses on package architecture, substrate design, manufacturability, and vendor engagement.\nKey Responsibilities\nSelect and design optimal multi-die package types (MCM, 2.5D, 3D, fan-out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.\n\nDefine package specifications, bump map and ball map, interposer requirements, and mechanical constraints.\n\nDefine substrate stack-ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.\n\nPerform high-speed signal escaping, routing and power distribution network design.\n\nManage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.\n\nPartner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system-level needs.\n\nEvaluate emerging packaging technologies and drive adoption for next-generation products.\n\nSupport package-level bring-up, failure analysis, debug and qualification.\n\nRequired Skills & Qualifications\nB.S./M.S. in Electrical Engineering or related field.\n\nExperience with multi-die package design and UCIe (AP/SP) integration.\n\nUnderstanding of substrate materials, stack-ups, and mechanical constraints.\n\nFamiliarity with SI/PI concepts to collaborate effectively with electrical teams.\n\nExperience managing packaging subcontractors.\n\nExperience interfacing with TSMC/OSAT for bumping and packaging options.\n\nKnowledge of package modeling tools (HFSS, Sigrity, or similar) is a plus.\n\nCompensation\nTarget base salary for this role is $180,000-$240,000 per year + meaningful equity + benefits + 401k. Our salary ranges are determined by role, level, experience, and location.\nWe are an equal opportunity employer. We value a range of perspectives and experiences and make employment decisions based on merit and business needs. We do not discriminate on the basis of legally protected characteristics.\nAgency Note:\nWe do not accept resumes from agencies or search firms. Please do not forward candidate profiles through our careers page, email, LinkedIn messages, or directly to company employees. Any resumes submitted will be deemed the property of the company, and no fees will be paid in the event the candidate is hired.","description_format":"text","description_chars":3445,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":["401k plan","Equity"],"hiring_locations":[{"name":"Canada","iso":"CA","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Artificial Intelligence","AI Agents"],"lifecycle":[{"event":"open","at":"2026-09-11T20:42:10Z"}],"liveness":{"score":7,"band":"cold","label":"Long shot","p_open":1,"p_active":0.236,"p_room":0.28,"age_days":103,"expected_fill_days":21,"reasons":["conf:4","win:tail","crowd:"],"computed_at":"2026-09-23T05:45:00Z"},"pay":{"stated_usd_annual":240000,"is_top_pay":true},"html_url":"https://alion.io/job/delosdata-package-engineer","json_url":"https://alion.io/job/delosdata-package-engineer.json","meta":{"generated_at":"2026-09-24T04:12:53Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers"}}