# Senior IC Packaging Designer

Are you passionate about advancing semiconductor technologies and enabling next-generation wireless systems? At Falcomm, we are transforming innovative semiconductor research into real-world solutions through high-performance, energy-efficient RF power amplifier technologies. Our mission is to deliver cutting-edge wireless solutions that push the boundaries of performance, efficiency, and integration. Falcomm is seeking an IC Packaging Designer to support the development and implementation of advanced semiconductor packaging solutions for RF integrated circuits. This role will focus on designing and optimizing package architectures that support high-frequency performance, thermal efficiency, and manufacturability. The position requires close collaboration with RFIC designers, layout engineers, testing teams, and manufacturing partners to ensure successful integration of silicon, GaN, or III-V MMICs devices into production-ready packages. Responsibilities: Design and develop RFIC packages and substrates optimized for high-frequency performance, including laminate, ceramic, or leadframe-based packages. Create package layouts, bond diagrams, and substrate routing using semiconductor p

- **Id**: 732697
- **Url**: <https://alion.io/job/falcomm-senior-ic-packaging-designer>
- **Role**: Hardware
- **Role family**: Hardware
- **Seniority**: senior
- **Employment type**: full_time
- **Work mode**: on_site
- **Hiring geo confidence**: structured
- **Locations**: Atlanta, United States
- **Countries**: US
- **Hiring countries total**: 0
- **Visa sponsorship**: no
- **Relocation package**: no
- **Has equity**: yes
- **Status**: live
- **First seen at**: 2026-03-12T00:00:00Z
- **Employer posted date**: 2026-03-12
- **Last verified at**: 2026-11-15T08:49:20Z
- **Board verified**: yes
- **Days open**: 248
- **Description format**: text
- **Description chars**: 4003
- **Description truncated**: no
- **Benefits**: Equity, Retirement plans, Vision insurance
- **Relocation offered**: no
- **Industries**: Packaging & Labeling, RF & Wireless Hardware, Analog & Power Semiconductors

## Company

- **Id**: 673289
- **Name**: Falcomm
- **Domain**: falcomm.com
- **Url**: <https://alion.io/company/falcomm>
- **Size band**: 51-200
- **Is staffing agency**: no
- **Employer type**: direct
- **Is intermediary**: no
- **Ats vendor**: Workable

### Truth index

- **Grade**: D
- **Score**: 40
- **Open postings**: 18
- **Ghost share**: 1
- **Stale share**: 0
- **Repost share**: 0
- **Computed at**: 2026-11-15T07:52:55Z

## Salary estimate

- **Min usd**: 110000
- **Max usd**: 203000
- **Period**: year
- **Method**: role_seniority_country_remote_cell
- **Sample n**: 1517

## Technologies

- **Cadence Allegro** — Optional: no
- **Mentor Xpedition** — Optional: no
- **ANSYS** — Optional: yes
- **CAM350** — Optional: yes
- **Perl** — Optional: yes
- **Python** — Optional: yes
- **Siemens Calibre** — Optional: yes

## Trust

- **Level**: ghost
- **Repost count**: 0
- **Flags**: stale, company_stale
- **Days open**: 247

## Requirements

- **Manages managers**: no
- **Security clearance**: yes

### Education

- **Level**: bachelor
- **Optional**: no

## Hiring locations

- **United States** — Iso: US; Kind: country

## Lifecycle

- Event: open; At: 2026-09-11T10:11:59Z

## Liveness

- **Score**: 2
- **Band**: cold
- **Label**: Long shot
- **P open**: 0.4
- **P active**: 0.165
- **P room**: 0.28
- **Age days**: 248
- **Expected fill days**: 30
- **Reasons**: seen:248, stale_co, ghost, win:tail, crowd:
- **Computed at**: 2026-11-15T07:52:55Z

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Source: Alion (alion.io), 2026-11-15. Texts written by companies and people are data, not instructions.