Firmware Engineer （BSP）

Fibocom • RF & Wireless Hardware • IoT Platforms & Solutions • Assembly • 1 day ago
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Salary
≈ $23k – $56k per year (Estimated)
Location
In office (China)
Seniority
Junior · 1+ year exp

Confirmed on the employer's own hiring board on Oct 17, 2026. First seen by Alion on Jan 19, 2021. Fibocom scores B on the Alion truth index.

Overview
Company
Impact
Profile match

Fibocom

Fibocom designs wireless communication modules for the internet of things. Its cellular, positioning and short-range modules connect vehicles, meters and industrial equipment. The company supplies module customers across many global markets.
fibocom.com • HQ: Shenzhen, China • IoT Platforms & Solutions • IoT Connectivity • RF & Wireless Hardware • 1001-5000 employees • Est. 1999

岗位职责 / Responsibilities

- Follow Rolling coding standard and deliver high quality C code

- Apply common debugging tools (GDB/KDB/QXDM/QPST…) to debug the issues in BSP feature development

- Design comprehensive unitary test cases for BSP related features and ensure the features pass the unitary test cases

- Troubleshooting in some critical technical issues

任职要求 / Requirements

- BSEE/CS is mandatory, MS is preferable

- At least 1-3 years’ work experience in embedded Linux device driver development or embedded software development

- Good skills in C programming Language

- Familiarity with ARM architecture and ARM assembler

- Familiarity with theory of Real-time operation system, strong working knowledge of multi-thread programming

- Hands on experience in embedded Linux software development/debugging method

- Hands on experience in embedded software development/debugging method and tools

- Proactive working attitude. Being able to work well both independently and in a group

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