Micro Assembly Process Engineer

Job Description:

Duties: Lead troubleshooting and repair of complex probe cards and sub-assemblies. Perform probe card troubleshooting, repair and maintenance. Support Manufacturing Engineering activities by recognizing, prioritizing, and actingimprovement opportunities, pioneering new ideas, and finding innovative methods to accomplishproduction goals. Coach and train technicians to develop teamwork, leadership, and technical skills. Perform operatorCore trainer training and certification across CWW shifts. Participate in tests and experiments to improve production processes or develop new products and processes.Support modifications of automated assembly systems process, alignment measurement parameters, as well as create and modifyprocedures for new products. Support first article probe cards including mechanical substrate alignment and sub-assembly,associated new tooling introduction, initial set-up and verification, various metrology steps, and rework if necessary. Project manageand participatein assembly equipment hardware and sofwareupgrades based on process quality and throughput objectives. Participate in equipment capacity increases, CapExProjects, and product related tooling capacity increases to ensure FormFactormeets capacity demand.

Education:

Required:Bachelor’sdegree or foreign equivalent in Manufacturing Engineering, Mechanical Engineeringor related field.

Experience:

Required:5 years of progressive experience as Field Service/Application Engineer, Quality Control Engineer, or relatedoccupation.

Special Requirements:Must have at least 1 year of work experience in each of the following:

1. Managing medium-to-complex analysis models in JMP, including process data, yield analysis, implementquality controls and DOEs using statistical program software.

2. Troubleshooting probe cards issues for all components.

3. NPI (new product introduction) processes and equipment assessment and customization.

4. Micro assembly process and equipment performance CPI (continuous process improvement) to lead improvement projects.

5. Using microscopes, micromanipulators, and metrology tools.

6. Troubleshooting and repairing precision electromechanical assemblies using root cause analysis techniques and standard measurement instruments.

7. Transferring process from early stage of development to LVM (LowVolume Manufacturing) and HVM (High Volume Manufacturing).

8. Dimensional inspection and alignment verification using metrology tools: optical measurement systems, calipers, micrometers, and dial indicators.

9. Establishing HVM processes including documentation, requirements, specifications, and manufacturing work instructions.

Salary: $147,248 to $152,248 per year

Worksite: 7005 SouthfrontRoad, Livermore, CA 94551

Equal Employment Opportunity Statement

FormFactor is an equal opportunity employer. FormFactor complies with all national, state, and local laws that seek to promote equal opportunities for any applicant or employee without regard to age, race, color, gender, gender identity/expression, national origin, sexual orientation, religion, disability, marital status, pregnancy or related condition, military service, or any other legally protected characteristics. These protections apply to all aspects of employment, including but not limited to, recruitment, hiring, training, promotions, and compensation.