Senior PCB Layout Engineer High-Density Multi-Layer / Cadence
Fuku
Intro: Looking for a Senior PCB Layout Engineer in Kuala Lumpur. Take charge of complex high-density, multi-layer board designs using Cadence layout tools. Must have strong experience with high-speed digital buses and RF paths. 3-day hybrid work setup.
Why you should apply
-The Ultimate Engineering Puzzle: Route multi-layer boards matching high-speed digital buses with sensitive RF paths.
-True Architectural Partner: Escape basic layouts where trace routing constraints do not matter.
-Schematic to Reality: Shape the signal and power paths that turn high-frequency designs into physical products.
About you
-Experience as: PCB Layout Designer, Printed Circuit Board Specialist, CAD Layout Engineer, or Hardware Mask Design Engineer.
-Level: Mid to senior layout engineering roles (5-8 years of experience).
Project / Client: A premier, iconic global telecommunications pioneer renowned for shaping carrier-grade mobile networks and setting the benchmark for international connectivity standards.
What you will do
-Execute intricate multi-layer PCB layouts for analog, digital, and RF circuits.
-Build and standardize global schematic symbols and precise footprint packages.
-Implement layout constraints for strict impedance control and EMI mitigation.
-Generate full fabrication packages and resolve queries directly with PCB factories.
Experience you need
-5+ years of dedicated, high-density multi-layer PCB layout experience.
-Expert-level daily utilization of Cadence layout tools, AutoCAD, and CAM350.
-Deep knowledge of multi-layer stackup design, DFM, and DFA manufacturing rules.
Work Arrangement / Benefits:
-Hybrid: 3 days a week in office / 2 days home.
-KL City (LRT / KTM accessible)
-Contract: 2-year extendable contract.