{"id":3697485,"url":"https://alion.io/job/ge-aerospace-advanced-lead-electronic-design-engineer","title":"Advanced Lead Electronic Design Engineer","company":{"id":13089,"name":"GE Aerospace","domain":"geaerospace.com","url":"https://alion.io/company/geaerospace","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":92,"open_postings":53,"ghost_share":0,"stale_share":0.528,"repost_share":0,"time_to_fill_p50_days":17,"computed_at":"2026-11-04T06:34:25Z"}},"role":"Hardware","role_family":"Hardware","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Querétaro, Mexico"],"countries":["MX"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ARINC","optional":false},{"name":"DO-254","optional":false},{"name":"HyperLynx","optional":false},{"name":"LTspice","optional":false},{"name":"Microsoft Office","optional":false},{"name":"MIL-STD-1553","optional":false},{"name":"OpenVPX","optional":false},{"name":"OrCAD","optional":false}],"status":"live","first_seen_at":"2026-11-03T18:31:48Z","employer_posted_date":"2026-11-03","last_verified_at":"2026-11-04T12:01:11Z","board_verified":true,"closed_at":null,"days_open":0,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":0},"description":"Job Description Summary\nAs a Advanced Lead Digital Design Engineer, you will be at the forefront of designing cutting-edge embedded systems for aerospace applications, adhering to DO-254 standards for New Product Introductions (NPIs) and Product Refreshes. Your expertise will shape avionics hardware architectures and support new bids and proposals.In this dynamic role, you will mentor and collaborate with lead design engineers on board-level circuit design, integration, verification, and documentation of state-of-the-art aerospace processors and FPGA assemblies. This position combines leadership with hands-on technical work, requiring you to contribute at every stage of the design cycle.\nYou will operate within defined parameters to make critical decisions, apply innovative concepts to complex challenges, and drive solutions through immediate action or short-term planning. Join us to influence the future of aerospace technology and take your career to new heights!\nJob Description\nResponsibilities\nArchitect complex avionics systems, integrating both digital and analog components.\nSupport activities for new bids and proposals, contributing to our growth and innovation.\nStay ahead of technology trends and advancements in embedded systems and electronic components.\nDesign processor and FPGA assemblies, including schematic capture, component placement, layout constraints, PWB stack-up, and layout review/approval.\nConduct board bring-up, integration, and verification activities to ensure robust performance.Troubleshoot complex issues involving processors, FPGAs, and memory components.\nApply Design for Manufacturing (DFM), Maintainability, and Testability principles to enhance product quality.Participate in architectural trade studies and proposal development to drive strategic decisions.\nInterface with customers independently, providing expert guidance and support.\nMentor junior engineers, fostering their growth and development.Lead and coordinate multi-disciplinary design teams, ensuring cohesive and effective collaboration.\nPropose and implement improvements in internal processes to drive efficiency and innovation. \nRequired Qualifications\nBachelor’s degree in Electrical Engineering or related field.\nProven experience in board-level digital design, including schematic design, implementation, integration, and verification.\nExpertise in designing high-speed interfaces.\nProficiency in Board Level Timing Analysis, Stress and Derate Analysis, Signal Integrity & Power Integrity.\nStrong problem-solving skills with the ability to break down complex issues and apply critical thinking.\nExceptional technical writing and communication skills.\nExperience mentoring and sharing expertise with junior engineers.\nInternal candidate must be at LPB level.\nDesired Characteristics\n Master’s degree in Electrical Engineering with 10+ years of professional experience in digital design.\nProven track record of architecting complex digital hardware systems.In-depth knowledge of the board-level digital design process, from schematic capture to implementation, integration, and verification.\nExpertise in laying out complex Printed Wiring Boards (PWBs).\nExperience designing with high-speed components such as Gigahertz microprocessors, FPGA, CPLD, DDR3 or DDR4 memory, flash memory, Gigabit Ethernet, and PCIe.Proficiency in working with large pin count devices, featuring 1000+ pins with 0.8mm device pitch or smaller.\nSkilled in High Density Interconnect (HDI) technologies, including micro vias, buried/blind vias, and back drilling for IPC Class 3 boards.\nExperience in designing high-speed serial links of 5+ Gbps, such as 10GBASE-KR, PCIe Gen3, and Fiber Optics.Familiarity with communication protocols like CAN, MIL-STD-1553, ARINC 429, ARINC 664, and TSN.Knowledge of OpenVPX and PICMG standards.\nExtensive experience in the Military, Aerospace, or Avionics sectors.\nProficient with Mentor Graphics Expedition Enterprise and HyperLynx PI/SI tools.\nFamiliarity with OrCAD PSPICE or LT Spice, Mathcad, Microsoft Office, and Microsoft Visio.\nStrong technical writing and communication skills.\nAbility to break down complex problems and apply critical thinking to develop effective solutions.\nAdditional Information\nRelocation Assistance Provided: No","description_format":"text","description_chars":4277,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":["Relocation assistance"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":true,"industries":["Aerospace Manufacturing","Defense 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