{"id":2872476,"url":"https://alion.io/job/globalfoundries-advanced-packaging-cryogenic-modeling-engineer","title":"Advanced Packaging Cryogenic Modeling Engineer","company":{"id":3730,"name":"GlobalFoundries","domain":"gf.com","url":"https://alion.io/company/globalfoundries","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":134,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Santa Clara, United States","United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":118000,"max":239000,"currency":"USD","period":"year","gross":null,"usd_annual":239000},"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"ANSYS","optional":false},{"name":"Keysight ADS","optional":true}],"status":"live","first_seen_at":"2026-05-12T00:00:00Z","employer_posted_date":"2026-05-12","last_verified_at":"2026-10-20T16:48:33Z","board_verified":true,"closed_at":null,"days_open":163,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":162},"description":"About GlobalFoundries:\nGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundriesmakespossible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visitwww.gf.com.\nSummary of Role: GlobalFoundries isseekingan experiencedthermal,mechanical, and/or electrical modeler/engineer withdemonstratedcryogenic modeling experience to support cryogenic packaging and system co-optimization R&D. The engineer will leverage commercial multi-physics tools to build, correlate, and apply models that capture low-temperature material property behavior and thermo-mechanical effects (e.g., thermal contraction and CTE mismatch) to guide device, integration, and cryogenic 3DHI advanced packaging optimizations for mechanical, thermal, and/or electrical performance.\nEssential Responsibilities:\nDemonstrated experience using commercial software to develop and correlate cryogenicthermal,mechanical, and/or electrical models for semiconductor devices and advanced packages (e.g., 77 K and below), including temperature-dependent material properties and boundary conditions.\n\nStress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.\n\nAnticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.\n\nFacilitate discussion withoriginatingteam toidentifysimulations that highlight critical process interactions and driveoptimal3DHI technology decisions.\n\nApply commercial simulation software to mimiccryogenicsemiconductor process flows and highlight the areas of concern.\n\nExtensive interaction with integration, device, and design engineers toassuredevelopment ofa workingtechnology.\n\nOther Responsibilities:\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirementsand programs.\n\nOther duties as assigned bymanager.\n\nRequired Qualifications:\nM.S. + minimum of10years of relevant experience.\n\nSemiconductor mechanical,thermaland/or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications.\n\nStrong problem solving and technical trouble shooting skills including expertisein design of experiment.\n\nMust have at least an overall 3.0 GPA and proven good academic standing.\n\nLanguage Fluency - English (Written & Verbal).\n\nSolid understanding of semiconductor processes and integration techniques.\n\nGood computer / software skills.\n\nAbility to clearly present results to small and large groups.\n\nTravel - Up to 10%.\n\nPreferred Qualifications:\nPhD +8years of relevant experience.\n\nThermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…).\n\nDemonstrated work performance in an environment requiringa highlevelof attention to detail and timeliness.\n\nDemonstrated prior leadership experience in the workplace, school projects, competitions, etc.\n\nProject management skills,i.e.the ability to innovate andexecutesolutions that matter; the ability to navigate ambiguity.\n\nStrong written and verbal communication skills.\n\nStrong planning& organizationalskills.\n\nExpected Salary Range\n$118,000.00 - $239,000.00The exact Salary will be determined based on qualifications, experience and location.\nIf you need a reasonable accommodation for any part of the employment process, please contact us by email at  let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\nAn offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\nGlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law","description_format":"text","description_chars":5233,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-19T20:14:57Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 100 · green card filings: 45","filings_12m":100,"filings_prev_12m":95,"green_card_filings_12m":45,"median_offered_wage_usd":110948,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16}],"liveness":{"score":10,"band":"cold","label":"Long shot","p_open":1,"p_active":0.34,"p_room":0.28,"age_days":162,"expected_fill_days":28,"reasons":["conf:12","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-21T05:46:15Z"},"pay":{"stated_usd_annual":239000,"is_top_pay":true},"html_url":"https://alion.io/job/globalfoundries-advanced-packaging-cryogenic-modeling-engineer","json_url":"https://alion.io/job/globalfoundries-advanced-packaging-cryogenic-modeling-engineer.json","meta":{"generated_at":"2026-10-22T02:55:04Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":2477,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-23T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3730},"rest":"https://alion.io/mcp/rest/get_company?id=3730"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fglobalfoundries-advanced-packaging-cryogenic-modeling-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fglobalfoundries-advanced-packaging-cryogenic-modeling-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fglobalfoundries-advanced-packaging-cryogenic-modeling-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/globalfoundries-advanced-packaging-cryogenic-modeling-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fglobalfoundries-advanced-packaging-cryogenic-modeling-engineer"}]}