{"id":1603192,"url":"https://alion.io/job/globalfoundries-advanced-packaging-modeling-engineer","title":"Advanced Packaging Modeling Engineer","company":{"id":3730,"name":"GlobalFoundries","domain":"gf.com","url":"https://alion.io/company/globalfoundries","size_band":"11-50","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":4,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":null,"computed_at":"2026-10-06T05:45:30Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"explicit","locations":["New York, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":98000,"max":176000,"currency":"USD","period":"year","gross":null,"usd_annual":176000},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Keysight ADS","optional":true}],"status":"live","first_seen_at":"2026-09-29T00:00:00Z","employer_posted_date":"2026-09-29","last_verified_at":"2026-10-06T21:31:40Z","board_verified":true,"closed_at":null,"days_open":7,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":7},"description":"We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies. This person will focus upon the use of commercial modeling tools for guiding device, integration and 3DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations. About GlobalFoundries:\nGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.\nSummary of Role: We are looking for an experiencedmechanical, thermalor electrical modeler / engineer to address 3DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies. This person will focus upon the use of commercial modeling tools for guiding device, integration and 3DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations.\nWork Location: This position is for a role in our state-of-the-art300mmfabrication facility in Malta, New York.\nEssential Responsibilities:\nFamiliarity with commercial software for mechanical or thermal or electrical modeling.\n\nStress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling.\n\nAnticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling.\n\nFacilitate discussion with originating team to identifysimulations that highlight critical process interactions and drive optimal3DHI technology decisions.\n\nApply commercial simulation software to mimic semiconductor process flows and highlight the areas of concern.\n\nExtensive interaction with integration, device, and design engineers to assure development of a working technology\n\nOther Responsibilities:\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirementsand programs.\n\nOther duties as assigned by manager.\n\nRequired Qualifications:\nM.S. + minimum of 5 years of relevant experience\n\nPhD + minimum of 3 years of relevant experience\n\nSemiconductor mechanical or thermal or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications\n\nMust have at least an overall 3.0 GPA and proven good academic standing.\n\nLanguage Fluency - English (Written & Verbal).\n\nSolid understanding of semiconductor processes and integration techniques\n\nGood computer / software skills\n\nAbility to clearly present results to small and large groups\n\nPreferred Qualifications:\nPhD + 5 years of relevant experience\n\nThermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…)\n\nDemonstrated work performance in an environment requiring a highlevelof attention to detail and timeliness.\n\nDemonstrated prior leadership experience in the workplace, school projects, competitions, etc.\n\nProject management skills, i.e.the ability to innovate and executesolutions that matter; the ability to navigate ambiguity.\n\nStrong written and verbal communication skills.\n\nStrong planning & organizational skills.\n\nExpected Salary Range\n$98,000.00 - $176,000.00The exact Salary will be determined based on qualifications, experience and location.\nIf you need a reasonable accommodation for any part of the employment process, please contact us by email at  let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\nAn offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\nGlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law","description_format":"text","description_chars":5316,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[{"name":"Malta","iso":"MT","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Manufacturing","Electrical & Electronic Engineering","Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-01T19:35:19Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 100 · green card filings: 45","filings_12m":100,"filings_prev_12m":95,"green_card_filings_12m":45,"median_offered_wage_usd":110948,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16}],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.903,"p_room":1,"age_days":7,"expected_fill_days":31,"reasons":["conf:4","velocity","win:early","comp:brand"],"computed_at":"2026-10-06T05:45:30Z"},"pay":{"stated_usd_annual":176000,"is_top_pay":false},"html_url":"https://alion.io/job/globalfoundries-advanced-packaging-modeling-engineer","json_url":"https://alion.io/job/globalfoundries-advanced-packaging-modeling-engineer.json","meta":{"generated_at":"2026-10-06T21:57:53Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":1976,"day_limit":5000,"remaining_today":3024,"minute_limit":60,"resets_at":"2026-10-07T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3730},"rest":"https://alion.io/mcp/rest/get_company?id=3730"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fglobalfoundries-advanced-packaging-modeling-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fglobalfoundries-advanced-packaging-modeling-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fglobalfoundries-advanced-packaging-modeling-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/globalfoundries-advanced-packaging-modeling-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fglobalfoundries-advanced-packaging-modeling-engineer"}]}