{"id":2327891,"url":"https://alion.io/job/globalfoundries-mts-3d-heterogenous-integration-engineer","title":"MTS 3D Heterogenous Integration Engineer","company":{"id":3730,"name":"GlobalFoundries","domain":"gf.com","url":"https://alion.io/company/globalfoundries","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":210,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-10-25T05:49:26Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["New York, United States","United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":98000,"max":176000,"currency":"USD","period":"year","gross":null,"usd_annual":176000},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-11T00:00:00Z","employer_posted_date":"2026-10-11","last_verified_at":"2026-10-24T02:26:47Z","board_verified":true,"closed_at":null,"days_open":14,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":14},"description":"About GlobalFoundries:\nGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.\nSummary of Role:\nGlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives, such as wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV, and interposer development.\nEssential Responsibilities:\nDrive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).\nDrive thermal solution to address power density, hotspot mitigation, thermal spreading, and package-level heat removal challenges in next-generation semiconductor products.\nPartner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. \nCollaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.\nDrive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.\nDevelop expertise in processes, materials, and tooling, and make efficient use of characterization resources.\nDrive data analysis, interpretation of results, and understanding of failure modes. \nIdentify and resolve process integration issues and related challenges.\nGenerate IP related to novel wafer integration and packaging technology.\nOther Responsibilities:\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. \nParticipate in hiring activities. \nMentor and guide new hires to assume their roles and responsibilities. \nOther duties as assigned by manager. \nRequired Qualifications:\nEducation - Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. \nMS degree with at least 5-6 years of prior related work experience. \nIn depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly thermal management.\nStrong problem solving and technical trouble shooting skills including expertise in design of experiment.\nMust have at least an overall 3.0 GPA and proven good academic standing. \nLanguage Fluency - English (Written & Verbal). \nTravel - Up to 20%. \nPreferred Qualifications:\nEducation - PhD education level preferred with at least 3-4 years of prior related work experience. \nDemonstrated prior leadership experience internally or with an OSAT eco-system. \nProject management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. \nStrong written and verbal communication skills. \nStrong planning and organizational skills. \nExpected Salary Range\n$98,000.00 - $176,000.00The exact Salary will be determined based on qualifications, experience and location.\nIf you need a reasonable accommodation for any part of the employment process, please contact us by email at  let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\nAn offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\nGlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law","description_format":"text","description_chars":5089,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-12T08:01:29Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 100 · green card filings: 45","filings_12m":100,"filings_prev_12m":95,"green_card_filings_12m":45,"median_offered_wage_usd":110948,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16}],"liveness":{"score":56,"band":"ok","label":"Likely open","p_open":1,"p_active":0.622,"p_room":0.9,"age_days":14,"expected_fill_days":30,"reasons":["conf:27","stale_co","velocity","win:mid","comp:brand"],"computed_at":"2026-10-25T05:49:26Z"},"pay":{"stated_usd_annual":176000,"is_top_pay":false},"html_url":"https://alion.io/job/globalfoundries-mts-3d-heterogenous-integration-engineer","json_url":"https://alion.io/job/globalfoundries-mts-3d-heterogenous-integration-engineer.json","meta":{"generated_at":"2026-10-25T09:10:00Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":13105,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-26T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3730},"rest":"https://alion.io/mcp/rest/get_company?id=3730"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fglobalfoundries-mts-3d-heterogenous-integration-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fglobalfoundries-mts-3d-heterogenous-integration-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fglobalfoundries-mts-3d-heterogenous-integration-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/globalfoundries-mts-3d-heterogenous-integration-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fglobalfoundries-mts-3d-heterogenous-integration-engineer"}]}