{"id":2880067,"url":"https://alion.io/job/globalfoundries-mts-packaging-integration-engineer","title":"MTS Packaging Integration Engineer","company":{"id":3730,"name":"GlobalFoundries","domain":"gf.com","url":"https://alion.io/company/globalfoundries","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":210,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-10-24T06:02:35Z"}},"role":"Hardware","role_family":"Hardware","seniority":"middle","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Essex Junction, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":94300,"max":175100,"currency":"USD","period":"year","gross":null,"usd_annual":175100},"salary_estimate":null,"experience_years_min":4,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false}],"status":"live","first_seen_at":"2026-04-21T00:00:00Z","employer_posted_date":"2026-04-21","last_verified_at":"2026-10-24T02:26:47Z","board_verified":true,"closed_at":null,"days_open":186,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":186},"description":"About GlobalFoundries:\nGlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.\nSummary of Role:\nThis hands-on assembly integration role will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on tool process interactions for each assembly step in a SiPh Flip Chip assembly. Focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal stress plan for chiplet and product module reliability qualifications.\nA successful candidate would possess assembly expertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with present state-of-the-art electrical interconnect solutions. It is expected that options for optical fiber attach will include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, Copper uPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding.\nEssential Responsibilities:\nDefines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets.\nEstablishment of manufacturing driven design rules.\nEnsures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.\nDriving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.\nProvides tools and complex analysis of quality issues and associated financial implications\nProtects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.\nEnsures standardization of site-based quality processes are executed appropriately\nDrives discipline and qualification robustness through a consistent global qualification process\nTypically performs one or more of the following in capacity of either an individual contributor (as directed and/or independently), or as a manager:Perform project management and data analysis\nIdentify and resolve process integration issues and related problems\nDevelop custom or derivative processes to meet customer needs\nSupport new designs with module characterization and design rule development \nWork with cross function teams to resolve technical & yield concerns\nDevelop and improve test structures that enable fast and rigorous characterization of process \nDrive CIP (Continuous improvement plans) to deliver organizational goals\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs\n\nOther Responsibilities:\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.\nRequired Qualifications:\nMS, or PhD + 4 or more years of experience\nExtensive experience with failure analysis, design of experiments, & packaging process integration.\nExperience in bringing packaged products from development into production.\nStrong written and spoken English communication skills\nPreferred Qualifications:\nMaterials science, thermal, mechanical, simulation background.\nValidated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.\nExpert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.\nBroad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.\nExpected Salary Range\n$94,300.00 - $175,100.00The exact Salary will be determined based on qualifications, experience and location.\nIf you need a reasonable accommodation for any part of the employment process, please contact us by email at  let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\nAn offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\nGlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law","description_format":"text","description_chars":6101,"description_truncated":false,"requirements":{"experience_years_min":4,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Upper-Intermediate (B2)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-19T22:33:36Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 100 · green card filings: 45","filings_12m":100,"filings_prev_12m":95,"green_card_filings_12m":45,"median_offered_wage_usd":110948,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16}],"liveness":{"score":5,"band":"cold","label":"Long shot","p_open":1,"p_active":0.184,"p_room":0.28,"age_days":186,"expected_fill_days":30,"reasons":["conf:3","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-24T06:02:35Z"},"pay":{"stated_usd_annual":175100,"is_top_pay":true},"html_url":"https://alion.io/job/globalfoundries-mts-packaging-integration-engineer","json_url":"https://alion.io/job/globalfoundries-mts-packaging-integration-engineer.json","meta":{"generated_at":"2026-10-24T14:38:41Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":20767,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-25T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3730},"rest":"https://alion.io/mcp/rest/get_company?id=3730"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fglobalfoundries-mts-packaging-integration-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fglobalfoundries-mts-packaging-integration-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fglobalfoundries-mts-packaging-integration-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/globalfoundries-mts-packaging-integration-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fglobalfoundries-mts-packaging-integration-engineer"}]}