{"id":1669319,"url":"https://alion.io/job/globalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration","title":"MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)","company":{"id":3730,"name":"GlobalFoundries","domain":"gf.com","url":"https://alion.io/company/globalfoundries","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":134,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-20T05:45:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Singapore"],"countries":["SG"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":59000,"max_usd":134000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":741},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-02T00:00:00Z","employer_posted_date":"2026-09-02","last_verified_at":"2026-10-20T16:48:33Z","board_verified":true,"closed_at":null,"days_open":48,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":48},"description":"About GF\nGlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high-performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remainsfocused every day on security, longevity, and sustainability. For more information, visit www.gf.com.\nIntroduction:\nGlobalfoundries Singapore is seeking highly skilled and motivated Experienced Member of Technical Staff (MTS)/Principal Process Engineer, to become part of our starting 300mm Advance Packaging Center, Singapore.\nThe primary responsibilities of this position are to develop and/or optimize unit processes to set up Advance Packaging related process (bond & Debond, pre-bond - Plasma / UV / cleaning process, Die re-constitution, annealing & TSV) on multi-stack bond wafer / Die-to-Wafer process (on wafer level or frame Form Carrier level), do troubleshooting for process and tool issues. Additionally, the candidate will be expected to assist in tooling start-up, installing the processes into manufacturing, and owning the processes and the tools in manufacturing.\nJob Responsibilities:\nDesigning, executing, and analyzing experiments to develop advanced packaging etch processes to meet technology (e.g. performance, yield, and reliability) and manufacturing (e.g. process stability, cost of ownership) targets.\n\nStartup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance and tool matching. Understand the concept of repeatability and reproducibility (R&R) run.\n\nImprove process robustness for high volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills. Use lean manufacturing and six sigma processes.\n\nTo work closely with equipment team to improve equipment productivity indices\n\nResolve complex technical issues in own Module or yield related issues.\n\nSupport the Integration team and Quality organization to ensure technology meet the qualification and reliability requirements.\n\nSustain and improve process / SPC to meet quality, cost, productivity requirements\n\nTo coach and develop other engineers on advance packaging Etch processes knowledge.\n\nFacilitate/ initiate CIP programs to optimize process window, cost, yield, and productivity. Establish plans and strategies to optimize process capability to meet operational requirements\n\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs\n\nRelated manufacturing and development experience is requested.\n\nRequired Qualifications:\nBS degree or Master's Degree or PhD in Electrical Engineering, Material Science & Engineering, Chemical Engineering, Physics, or other relevant engineering discipline is required\n\n4+ (PhD), 6+ (MSc), 8+ (BSc) years working experience in advanced packaging industry\n\nRequired experience of Leading Fab wide cross modules process development and projects coordination. Hands-on experience in advanced packaging (Si interposer, D2W, W2W) process tools.\n\nExcellent verbal and written communication skills.\n\nStrong interpersonal skills and ability to work effectively with different cultures.\n\nConduct regular meetings with PI & UMD for knowledge learning, with yearly projects that improve quality, cost, yield, or productivity. Cost reduction\n\nTake charge of group development and needs\n\nGlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiencyand innovation whilst our employees feel truly respected, valuedand heard.\nAs an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.\nAll offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.\nNo Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices.Candidates will not be charged any fees at any stage of the recruitment process. Any request for payment related to a GlobalFoundries employment opportunity is unauthorized and should be reported immediately. All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels. To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at  or visit our official website.\nThe Ethics & Compliance mailbox is not a recruitment channel. CVs/resumes submittedto this mailbox will not be reviewed, processed, or considered for employment opportunities. Please apply through the official GlobalFoundries careers site only.\nInformation about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia","description_format":"text","description_chars":5338,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Manufacturing","Electrical & Electronic Engineering","Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-02T06:19:43Z"}],"visa":[],"liveness":{"score":22,"band":"cold","label":"Long shot","p_open":1,"p_active":0.499,"p_room":0.45,"age_days":48,"expected_fill_days":28,"reasons":["conf:5","stale_co","velocity","win:tail","comp:brand"],"computed_at":"2026-10-20T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/globalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration","json_url":"https://alion.io/job/globalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration.json","meta":{"generated_at":"2026-10-20T18:32:20Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":21350,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-21T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3730},"rest":"https://alion.io/mcp/rest/get_company?id=3730"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fglobalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fglobalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fglobalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/globalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fglobalfoundries-mtsprincipal-process-module-engineer-advanced-packaging-program-2-5d-and-3d-heterogeneous-integration"}]}