{"id":2872479,"url":"https://alion.io/job/globalfoundries-pmts-photonics-packaging-design-integration","title":"PMTS Photonics Packaging Design Integration","company":{"id":3730,"name":"GlobalFoundries","domain":"gf.com","url":"https://alion.io/company/globalfoundries","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":188,"ghost_share":0,"stale_share":0.984,"repost_share":0,"time_to_fill_p50_days":31,"computed_at":"2026-10-23T05:54:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Essex Junction, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":131900,"max":241500,"currency":"USD","period":"year","gross":null,"usd_annual":241500},"salary_estimate":null,"experience_years_min":15,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"HPC","optional":false},{"name":"Design of Experiments","optional":true}],"status":"live","first_seen_at":"2026-05-07T00:00:00Z","employer_posted_date":"2026-05-07","last_verified_at":"2026-10-23T04:58:49Z","board_verified":true,"closed_at":null,"days_open":169,"trust":{"level":"stale","repost_count":0,"flags":["stale"],"days_open":169},"description":"About GlobalFoundries:\nGlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.\n\nSummary of Role:\nAs a Photonic Packaging Design Integration Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design. Focus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonicand thermal definition for chipletand product modules as well as reliability qualification approaches.\n\nEssential Responsibilities:\nDrives SiPhadvanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.\n\nSupport new customer products with innovative design solutions and technology design rules.\n\nDrives design reviews with cross functional teams\n\nDrivescross function teams to resolve technical & yield concerns\n\nDevelops engineersskills in packaging design constraints and considerations\n\nDevelopscomplex analysismodels to predictformanufacturability, cost, and quality.\n\nProtects the business by ensuring that all necessary requirements are met and that the technology performs tothe expectations of customers and marketto avoid costly re-designs.\n\nDrives discipline and qualification robustness through a consistent global design processes\n\nDrive CIP (Continuous improvement plans) to deliver organizational goals.\n\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirementsand programs\n\nOther Responsibilities:\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.\nRequired Qualifications:\nMS +20, or PhD + 15 or more years of experience\n\nExperience in bringing packaged products from development into production.\n\nExperience with HFSS, Zmax, Flotherm, or other design and modeling tools.\n\nAdvanced packaging design and layout expertise\n\nStrong written and spoken English communication skills\n\nPreferred Qualifications:\nMaterials science, thermal, mechanical, simulation background.\n\nExperience withfailure analysis, design of experiments, & packaging process integration.\n\nValidated record of photonic and electrical interconnect innovation and product release internally or withan OSAT ecosystem.\n\nExpert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPhadvanced packaging.\n\nExperiment\n\nBroad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.\n\nExpected Salary Range\n$131,900.00 - $241,500.00The exact Salary will be determined based on qualifications, experience and location.\nIf you need a reasonable accommodation for any part of the employment process, please contact us by email at  let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\nAn offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\nGlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law","description_format":"text","description_chars":5291,"description_truncated":false,"requirements":{"experience_years_min":15,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Upper-Intermediate (B2)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Packaging & Labeling","Optical Communications","Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-19T20:14:57Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 100 · green card filings: 45","filings_12m":100,"filings_prev_12m":95,"green_card_filings_12m":45,"median_offered_wage_usd":110948,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16}],"liveness":{"score":9,"band":"cold","label":"Long shot","p_open":1,"p_active":0.326,"p_room":0.28,"age_days":169,"expected_fill_days":31,"reasons":["conf:0","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-23T05:54:15Z"},"pay":{"stated_usd_annual":241500,"is_top_pay":false},"html_url":"https://alion.io/job/globalfoundries-pmts-photonics-packaging-design-integration","json_url":"https://alion.io/job/globalfoundries-pmts-photonics-packaging-design-integration.json","meta":{"generated_at":"2026-10-23T07:34:35Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":12219,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-24T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3730},"rest":"https://alion.io/mcp/rest/get_company?id=3730"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fglobalfoundries-pmts-photonics-packaging-design-integration"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fglobalfoundries-pmts-photonics-packaging-design-integration"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fglobalfoundries-pmts-photonics-packaging-design-integration"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/globalfoundries-pmts-photonics-packaging-design-integration\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fglobalfoundries-pmts-photonics-packaging-design-integration"}]}