{"id":1669192,"url":"https://alion.io/job/globalfoundries-smts-photonics-advanced-packaging-integration","title":"SMTS Photonics Advanced Packaging Integration","company":{"id":3730,"name":"GlobalFoundries","domain":"gf.com","url":"https://alion.io/company/globalfoundries","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":75,"open_postings":134,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":28,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Essex Junction, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":107400,"max":204500,"currency":"USD","period":"year","gross":null,"usd_annual":204500},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false},{"name":"HPC","optional":false},{"name":"Python","optional":true}],"status":"live","first_seen_at":"2026-09-18T00:00:00Z","employer_posted_date":"2026-09-18","last_verified_at":"2026-10-20T16:48:33Z","board_verified":true,"closed_at":null,"days_open":34,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":34},"description":"About GlobalFoundries:\nGlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. \nSummary of Role:\nAs a Photonic Packaging Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets.\nEssential Responsibilities:\nOwn the definition, design, and qualification of optical packaging architectures for SiPh-based modules, including fiber attach, photonic die placement, and thermal/mechanical integration.\nDevelop and implement scalable fiber-to-chip coupling strategies (e.g., V-groove, passive alignment, lens integration) for high-density optical I/O.\nDrive heterogeneous integration (HI) of photonic and electronic components using 2.5D/3D/3.5D packaging technologies (e.g., TSV, Cu-Cu hybrid bonding, advanced molded integration).\nPerform multiphysics simulations (thermal, mechanical, optical) to optimize package performance and reliability.\nLead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and FA tools.\nCollaborate with OSATs and internal manufacturing teams to ensure mass production readiness and process transfer.\nSupport cost modeling and drive package cost reduction initiatives aligned with GF’s B2B supply chain strategy.\nPresent technical updates and roadmaps to internal stakeholders and external partners.\nOther Responsibilities:\nPerform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.\nRequired Qualifications:\nMaster’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or related field.\n5+ years of experience in semiconductor packaging, with a focus on photonic or advanced packaging.\nHands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.\nFamiliarity with packaging technologies such as die attach, flip-chip, underfill, molding, and micro-optics integration.\nUnderstanding of reliability standards and qualification methodologies for optical modules.\nExcellent analytical, problem-solving, and communication skills.\nExperience in bringing packaged products from development into production.\nStrong written and spoken English communication skills.\nPreferred Qualifications:\nExperience with automated optical/electro-optical test setups and motion control systems (e.g., Python-based).\nKnowledge of co-packaged optics (CPO), pluggable modules, and silicon photonics ecosystems.\nStrong background in thermal/mechanical modeling and optical simulation tools (e.g., Lumerical, COMSOL).\nFamiliarity with GF’s Fotonix™ platform, including 300mm monolithic SiPh integration and advanced packaging flows.\nExperience working with OSATs and managing external development partners.\nDemonstrated ability to lead cross-functional teams and influence technical direction.\nExpected Salary Range\n$107,400.00 - $204,500.00The exact Salary will be determined based on qualifications, experience and location.\nIf you need a reasonable accommodation for any part of the employment process, please contact us by email at  let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.\nAn offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.\nGlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.\nAll policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law","description_format":"text","description_chars":5364,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Upper-Intermediate (B2)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Optical Communications","Manufacturing","Electrical & Electronic Engineering","Semiconductor Manufacturing"],"lifecycle":[{"event":"open","at":"2026-10-02T06:19:43Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 100 · green card filings: 45","filings_12m":100,"filings_prev_12m":95,"green_card_filings_12m":45,"median_offered_wage_usd":110948,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16}],"liveness":{"score":30,"band":"fade","label":"Fading","p_open":1,"p_active":0.546,"p_room":0.55,"age_days":33,"expected_fill_days":28,"reasons":["conf:12","stale_co","velocity","win:tail","comp:brand"],"computed_at":"2026-10-21T05:46:15Z"},"pay":{"stated_usd_annual":204500,"is_top_pay":true},"html_url":"https://alion.io/job/globalfoundries-smts-photonics-advanced-packaging-integration","json_url":"https://alion.io/job/globalfoundries-smts-photonics-advanced-packaging-integration.json","meta":{"generated_at":"2026-10-22T03:06:31Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":2776,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-23T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":3730},"rest":"https://alion.io/mcp/rest/get_company?id=3730"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fglobalfoundries-smts-photonics-advanced-packaging-integration"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fglobalfoundries-smts-photonics-advanced-packaging-integration"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fglobalfoundries-smts-photonics-advanced-packaging-integration"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/globalfoundries-smts-photonics-advanced-packaging-integration\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fglobalfoundries-smts-photonics-advanced-packaging-integration"}]}