{"id":3386805,"url":"https://alion.io/job/google-electrical-manufacturing-engineer-iii-pie-aoe","title":"Electrical Manufacturing Engineer III, PIE AOE","company":{"id":82,"name":"Google","domain":"google.com","url":"https://alion.io/company/google","size_band":"11-50","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"B","score":80,"open_postings":151,"ghost_share":0.046,"stale_share":0.649,"repost_share":0.046,"time_to_fill_p50_days":30,"computed_at":"2026-10-31T05:58:55Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Sunnyvale, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":90000,"max_usd":164000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":4330},"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"GCP","optional":false},{"name":"Agile","optional":true}],"status":"live","first_seen_at":"2026-10-27T16:10:05Z","employer_posted_date":"2026-10-30","last_verified_at":"2026-10-31T09:57:10Z","board_verified":true,"closed_at":null,"days_open":3,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":3},"description":"About the job\nAs an Electrical Manufacturing Engineer in the Platforms Infrastructure Engineering (PIE) Advanced Operations Engineering (AOE) team, you evaluate product designs and create the processes, tools, and procedures that power Google’s technical infrastructure, while serving as an onsite technical expert to ensure manufacturing processes are repeatable and controlled when partners produce components. You collaborate with cross-functional engineers to determine infrastructure needs and product specifications, leading the development and scale of new PCBA manufacturing and materials technologies for Google Cloud data center products as part of the New Technology Introduction process. Ultimately, your work provides technical leadership for cutting-edge approaches to release hardware to mass production, developing the supply chain, and ensuring that all pieces of Google’s infrastructure fit together to keep systems running smoothly for a seamless user experience.\nOur Platforms Infrastructure Engineering team designs and builds the\nhardware and software technologies that power all of Google's services. Our computational challenges are complex and unique, enabled by cutting-edge custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concept all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers, affecting millions of Google users.\n Individual pay is determined by factors including job-related skills, experience, and relevant education or training.\nUS: $132000 - $189000 (USD) + 15% bonus target + equity + benefits\nLearn more about benefits at Google.\nResponsibilities\nSupport Advanced Manufacturing Engineers in developing, defining, and qualifying industry-first manufacturing processes.\nPlan and implement innovative processes into established production and capacity workflows to hit forecast targets.\nCreate critical manufacturing documentation, including Bills of Materials (BOM), assembly drawings, and work instructions.\nEstablish and maintain manufacturing and quality standards for new technologies using existing tools.\nCollaborate with design teams and manufacturing partners on Design for Excellence (DfX), build readiness, and solve design/process challenges for NPI launches\nQualifications\nMinimum qualifications:\nBachelor’s degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, a related field, or equivalent practical experience.\n2 years of experience in manufacturing process development in semiconductor packaging or Surface Mount Technology.\nExperience with development of PCBA manufacturing processes including acceptance testing, startup, and qualification.\nExperience in new site/line/equipment bring-up/transfer and qualification for PCBA and system integration.\nPreferred qualifications:\nMaster’s degree in Mechanical, Industrial, or Electrical Engineering, or a related discipline.\nExperience with Product Data Management (PDM) tools (e.g., SAP, Agile, Windchill).\nExperience developing solid, effective technical relationships with contract manufacturers and vendors.\nExperience in SMT manufacturing and process development for datacenter hardware, including applying DFM, DOE, thermo-mechanical dynamics, and process optimization.\nAbility to drive root cause analysis, corrective actions, and continuous process improvements with cross-functional teams, contract manufacturers, and suppliers.\nDemonstrate ability to communicate effectively with multi-geographic teams, collaborate to achieve project goals, contribute positively to the engineering community, manage complex projects spanning multiple technologies.","description_format":"text","description_chars":3855,"description_truncated":false,"requirements":{"experience_years_min":2,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":["Equity"],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Internet Services","Digital Storage","Digital Media","Marketing Analytics & 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