{"id":2525097,"url":"https://alion.io/job/google-hardware-systems-integration-engineer-foldable","title":"Hardware Systems Integration Engineer, Foldable","company":{"id":82,"name":"Google","domain":"google.com","url":"https://alion.io/company/google","size_band":"11-50","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"B","score":75,"open_postings":116,"ghost_share":0,"stale_share":0.983,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-10-14T06:34:16Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["New Taipei, Taiwan"],"countries":["TW"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":18500,"max_usd":44000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1605},"experience_years_min":7,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-14T09:08:56Z","employer_posted_date":"2026-10-14","last_verified_at":"2026-10-14T12:06:12Z","board_verified":true,"closed_at":null,"days_open":0,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":0},"description":"About the job\nGoogle's mission is to organize the world's information and make it universally accessible and useful. Our Devices & Services team combines the best of Google AI, Software, and Hardware to create radically helpful experiences for users. We research, design, and develop new technologies and hardware to make our user's interaction with computing faster, seamless, and more powerful. Whether finding new ways to capture and sense the world around us, advancing form factors, or improving interaction methods, the Devices & Services team is making people's lives better through technology.Responsibilities\nDesign, develop, and review phone hardware systems and sub-components from concept to mass production.\nDesign and execute comprehensive system integration stress tests to identify edge cases and validate hardware reliability to mass production.\nParticipate in all stages of next generation consumer product development.\nDevelop the design process to optimize Printed Circuit Board (PCB) design, including circuit and layout designs for high-speed signal Flexible Printed Circuits (FPCs) and connectors, optimize advanced charging technologies, and perform rigorous charging and thermal Critical User Journey (CUJ) tuning and system optimization.\nLead complex system integration by driving the electrical integration of phone architecture to resolve unprecedented thermal, Power Delivery Network (PDN), and packaging bottlenecks within an ultra-constrained thickness.\nQualifications\nMinimum qualifications:\nBachelor’s degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.\n4 years of experience implementing product development lifecycles for mass-production hardware designs.\nPreferred qualifications:\nMaster's or PhD degree in Electrical Engineering, Computer Engineering, Physics, or a related field.\n7 years of experience implementing product development lifecycles for mass-production hardware designs.\n1 year of experience in technical leadership.\nExperience working with IP, SoC and platform design teams on the definition of power delivery network.\nExperience with high speed design and system power charging at chipset, baseband, and system 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