{"id":2694204,"url":"https://alion.io/job/google-physical-design-technical-lead-asic-tpu","title":"Physical Design Technical Lead, ASIC, TPU","company":{"id":82,"name":"Google","domain":"google.com","url":"https://alion.io/company/google","size_band":"11-50","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"B","score":75,"open_postings":114,"ghost_share":0,"stale_share":0.982,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-10-17T05:46:00Z"}},"role":"Hardware","role_family":"Hardware","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Sunnyvale, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":167000,"max_usd":317000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":576},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Edge AI","optional":false},{"name":"GCP","optional":false},{"name":"Perl","optional":false},{"name":"Python","optional":false},{"name":"TPU","optional":false},{"name":"Vertex AI","optional":false},{"name":"Cadence Innovus","optional":true},{"name":"Siemens Calibre","optional":true},{"name":"Synopsys StarRC","optional":true}],"status":"live","first_seen_at":"2026-09-25T13:12:24Z","employer_posted_date":"2026-10-16","last_verified_at":"2026-10-18T07:31:19Z","board_verified":true,"closed_at":null,"days_open":22,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":22},"description":"About the job\nBe part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.\nGoogle’s Tensor Processing Units (TPUs) are incredibly complex, pushing the boundaries of physical design, power, and performance. In this role, you will provide technical leadership for the physical design of our next-generation AI silicon. Because of the sheer scale of our chips, our physical design leadership is highly dynamic; you will be expected to drive end-to-end execution with a scope that scales from owning highly complex, critical macro-subsystems up to overarching project-wide top-level implementation, depending on project needs.\nThe AI and Infrastructure team is redefining what’s possible. We empower Google customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include Googlers, Google Cloud customers, and billions of Google users worldwide.\nWe're the driving team behind Google's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Google Cloud, Google Global Networking, Data Center operations, systems research, and much more.\n Individual pay is determined by factors including job-related skills, experience, and relevant education or training.US: $192000 - $278000 (USD) + 20% bonus target + equity + benefits\nLearn more about benefits at Google.\nResponsibilities\nLead the physical design implementation and strategy for high-performance silicon, with leadership scope ranging from critical, high-complexity subchips to overarching top-level execution based on project phases and team needs.\nManage the full design cycle from RTL to GDSII, including critical sign-off closures for timing, electrical performance, and power integrity.\nPartner with internal teams (RTL, DFT, methodology, packaging) to achieve optimal power, performance, and area (PPA) results, including conducting feasibility studies for new microarchitectures and optimizing RTL runs.\nCollaborate with external EDA and IP vendors to improve flows and methodologies, while contributing to internal processes to ensure efficient and predictable execution.\nDrive execution schedules, resource planning, and risk mitigation for your area of ownership, scaling your leadership to support overall project-wide milestones.\nQualifications\nMinimum qualifications:\nBachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.\n10 years of experience in physical design, including leading full-chip or sub-chip implementation such as RTL2GDSII and overseeing key stages like floorplanning, place and route, and timing closure for high-speed ASICs across various process nodes.\nExperience in Python, Tcl, or Perl scripting.\nPreferred qualifications:\nMaster's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.\nExperience with Cadence Innovus, Synopsys DP, Mentor Calibre, and StarRC, plus understanding of foundry technology files, rule decks, physical sign-off, and 2.5D/3D packaging.\nTechnical leadership experience managing execution schedules, mitigating risks, and driving cross-functional collaboration with internal teams and external vendors.\nUnderstanding of performance, power, and area trade-offs, alongside knowledge of DFT including Scan, MBIST, and LBIST.\nAbility to navigate ambiguity, scale leadership across the physical design hierarchy, and excellent communication skills to articulate complex technical challenges to 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