Senior Failure Analysis Engineer, Opto-Mechanical Modules

About the job

For decades, the computing revolution has reshaped our world driven by breakthroughs in compute, connectivity, mobile, and now, AI. Google's XR team is at the forefront of the next major leap - the convergence of AI and XR. This is more than just new devices - it's about reimagining how we interact with the world around us. We're building a future where lightweight XR Glasses pair with helpful AI to augment human intelligence, offering personalized, conversational, and contextually aware experiences. By integrating micro-displays, optics, and opto-mechanical modules like camera, Light Engine Assemblies (LEA) and Display Sub-Assemblies (DSA), our team delivers high-performance, and delightful hardware experiences.Google's Raxium display group has established a revolutionary semiconductor materials display technology that enables new functionality in display products, bringing to users a closer and more natural linkage between the digital and physical realms in applications such as augmented reality (AR) and light-field display. With start-up roots and a state-of-the-art compound semiconductor fab in Silicon Valley, Raxium is seeking to build upon its engineering team with an aim to disrupt next-generation display markets.Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google.

Responsibilities

• Support end-to-end failure analysis (FA) investigations for next-generation Light Engine Assemblies (LEAs), including microLED displays, modules, and associated sub-components.
• Analyze and diagnose component failures originating from NPI builds, reliability qualification testing, production excursions, and field returns.
• Perform lab analysis using advanced techniques, including electrical testing, optical setups, firmware debugging, SEM/EDX, FIB, TEM, X-ray/CT inspection, Scanning Acoustic Microscopy (SAM), micro-probing, and physical cross-sectioning.
• Define and standardize FA workflows, fault isolation procedures, and Turnaround Time (TAT) performance metrics.
• Pinpoint underlying physical failure mechanisms and collaborate with design, process, and quality teams to implement root-cause solutions and corrective actions.

Qualifications

Minimum qualifications:

• Bachelor's degree in Materials Science, Optical engineering, Electrical Engineering, Physics, Mechanical Engineering, or equivalent practical experience.
• 4 years of experience working in a failure analysis role for displays or semiconductor modules.
• Experience with optoelectronic modules, including working principles, manufacturing and assembly, testing and characterization, and failure modes.
• Experience operating physical failure analysis (FA) tools (e.g., SEM/EDX, FIB, X-ray, cross-section/polishing, optical microscopy) and electrical fault isolation equipment.

Preferred qualifications:

• Master's degree or PhD in Materials Science, Physics, Electrical Engineering, Optics/Photonics, or related discipline.
• 8 years of failure analysis experience specializing in micro displays, projectors, optoelectronics systems, or optical modules.
• Deep expertise in advanced non-destructive and destructive FA techniques and tools, for displays and electro-optical subassemblies.
• Experience leading root-cause analysis (RCA) and delivering actionable failure analysis reports to cross-functional engineering teams.
• Strong knowledge of display module failure mechanisms (e.g., wire bond fatigue, die cracking, delamination, active alignment shift, optical degradation, moisture ingress, EOS/ESD).