{"id":1543603,"url":"https://alion.io/job/google-staff-hardware-systems-engineer-watches","title":"Staff Hardware Systems Engineer, Watches","company":{"id":82,"name":"Google","domain":"google.com","url":"https://alion.io/company/google","size_band":"11-50","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Career site","truth_index":{"grade":"B","score":75,"open_postings":103,"ghost_share":0,"stale_share":1,"repost_share":0,"time_to_fill_p50_days":30,"computed_at":"2026-10-12T06:55:09Z"}},"role":"Hardware","role_family":"Hardware","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Mountain View, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":172000,"max_usd":310000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":469},"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-30T16:08:31Z","employer_posted_date":"2026-09-30","last_verified_at":"2026-10-12T11:11:43Z","board_verified":true,"closed_at":null,"days_open":11,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":11},"description":"About the job\nThe Pixel Watch Electrical Engineering (EE) team is responsible for the end-to-end hardware development of Google's first-party (1P) Watch products. We work with product managers during initial concept and design phases, guide new technology investigations, and manage the entire hardware lifecycle-from board integration and comprehensive validation to overseeing manufacturing to deliver products with an advanced user experience and health sensing capabilities.\nWe are seeking a highly skilled and visionary Electrical Engineer to lead the hardware integration and electrical architecture for our next-generation hardware.\nIn this role, you will be the technical anchor for form factor integration, strategizing how to partition silicon into compact enclosures while maximizing power efficiency and thermal performance.\nYou will operate at the intersection of electrical, mechanical, and systems engineering, pushing the boundaries of what is physically possible. You will be solving multi-dimensional hardware puzzles, driving architectural convergence across teams, and turning New Technology Introductions (NTIs) into mass-produced reality.\nIndividual pay is determined by factors including job-related skills, experience, and relevant education or training.US: $188000 - $274000 (USD) + 20% bonus target + equity + benefits\nLearn more about benefits at Google.\nResponsibilities\nDrive end-to-end electrical architecture for space-constrained devices, leveraging advanced packaging technologies like System in Package (SIP) and rigid-flex to maximize density and minimize Z-height.\nAct as the technical linchpin, collaborating with mechanical, Radio Frequency (RF), sensors, and display teams to resolve physical layout collisions and foster architectural convergence.\nLead data-driven trade-offs balancing size, performance, cost, and thermals to keep development moving while optimizing SoC integration for power and thermal efficiency.\nGuide New Technology Introductions (NTI) to integrate novel, market-differentiating hardware components into the final product design.\nEnsure design for manufacturability (DFM) by overseeing rapid prototyping and validation of early-stage systems, ensuring compact architectures can be reliably scaled for mass production.\nQualifications\nMinimum qualifications:\nBachelor's degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience.\n6 years of experience working in a consumer electronics technical environment.\n3 years of experience in technical leadership.\nPreferred qualifications:\n10 years of consumer electronics experience, specializing in HDI design, FPC, and rigid-flex assemblies.\nExperience in advanced packaging (SiP, PoP, CoW) to drive system miniaturization.\nExperience in lifecycle management from concept and NTI through EVT/DVT to mass production.\nExperience in adjacent disciplines like RF, thermal, and mechanical 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