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Location
In office (Paris)
Employment
Full-Time
Overview
Company
Impact
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Harmattan AI is a French defense technology company headquartered in Paris. Founded in 2024 by Mouad M'Ghari, the company operates as a next-generation "defense prime" specializing in vertically integrated autonomous systems, AI-enabled mission software, and scalable uncrewed platforms for modern warfare.

About Us

Harmattan AI is a next-generation defense prime building autonomous and scalable defense systems. Following the close of a $200M Series B, valuing the company at $1.4 billion, we are expanding our teams and capabilities to deliver mission-critical systems to allied forces.

Our work is guided by clear values: building technologies with real-world impact, pursuing excellence in everything we do, setting ambitious goals, and taking on the hardest technical challenges. We operate in a demanding environment where rigor, ownership, and execution are expected.

About the Role

As a Mechanical Engineer within our Electronic Warfare team, you will design the mechanical structures and packaging that house and protect our EW/SIGINT electronics in demanding field conditions - from concept to field deployment. You will translate RF and electronic constraints into robust mechanical designs, working hand-in-hand with hardware, software, GNC and ML teams.

Responsibilities

  • RF Electronic Packaging: Design mechanical packaging for RF and high-power electronics (a core requirement of the role).

  • Thermal Management: Design thermal solutions for high-power, high-density electronics.

  • Shielding & Cabling: Integrate EMI/RF shielding and manage cable routing and constraints.

  • Mechanical Design: Own mechanical design from concept through prototyping and validation.

  • Technical Coordination: Collaborate across HW, software, GNC and ML teams on integration and technical interfaces.

  • System Reviews & Documentation: Contribute to design and architecture reviews and maintain documentation and traceability.

Candidate Requirements

  • Experience in RF electronic packaging is a must.

  • Previous RF experience (radar, radio or EW) is a strong plus, to keep the associated constraints in mind (shielding, thermal, cabling, etc.).

  • Strong background in mechanical design, thermal management and packaging.

  • Broad engineering culture with understanding of electrical and embedded systems.

  • MSc in Mechanical Engineering; PhD is a plus.

  • Rigorous, structured and mission-driven mindset with strong analytical skills.

  • Excellent communication and documentation abilities.

We look forward to hearing how you can help shape the future of autonomous defense systems at Harmattan AI.

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