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Location
In office (Taipei)
Seniority
Senior · 10+ years exp
Employment
Full-Time
Overview
Company
Impact
Profile match
HP Inc. is an American technology company created in 2015 when the original Hewlett-Packard split its personal systems and printing businesses away from its enterprise arm. It is one of the largest personal computer vendors in the world, shipping consumer and commercial laptops, desktops and workstations under the HP, Pavilion, Envy, EliteBook, OMEN and Poly brands, alongside a printing division covering home, office, large-format and industrial 3D printing. Headquartered in Palo Alto, California, the company earns a large share of profit from supplies and services attached to its installed base and has pushed into hybrid-work peripherals and subscription hardware.
Senior Manager, Mechanical and Solution Engineering, Workstations

Description -

Location Requirement

Candidates must perform the job in Taipei, Taiwan and be authorized to work in Taiwan.

Position Overview

This role is responsible for providing engineering leadership to a team of sub-ordinate managers and individual contributors, while applying expert subject matter knowledge. The role acts as a key advisor to senior management on the development of overall policies and long-term goals of the organization. The role plans, manages and monitors high-end operational/tactical activities of the employees, and engages with a range of stakeholders to provide program updates and contributes to strategic decision-making. The role identifies opportunities to optimize processes and reduce costs, aligning changes with business goals.

People Leadership

  • Lead, coach, and develop a team of multi engineering disciplines.

  • Foster a culture of innovation, accountability, collaboration, and continuous improvement.

  • Establish clear goals and ensure alignment with business and product roadmaps.

Mechanical & Thermal Development

  • Own the mechanical and thermal design strategy for entry workstation platforms.

  • Ensure products achieve industry-leading thermal performance, system reliability, acoustic targets, and manufacturability.

  • Oversee thermal simulations, airflow optimization, cooling technology evaluation, and mechanical system integration.

System Integration & Solution Development

  • Lead integration of turnkey solutions, emerging technologies, and new components into workstation platforms.

  • Partner with internal and external technology providers to assess and implement new solutions.

  • Drive development of customized workstation solutions for advanced customer workflows and specialized use cases.

  • Ensure system-level performance optimization, and design scalability across product portfolios.

Cross-Functional Leadership

  • Collaborate with Electrical Engineering, BIOS/Firmware, Platform Architecture, Product Management, Supply Chain, Procurement, Manufacturing, Quality, and Service teams.

  • Influence product roadmaps and architecture decisions to support future technology adoption.

  • Manage tradeoff decisions across performance, acoustics, cost, quality, power, and schedule.

Product Performance & Innovation

  • Drive the development of high-performance workstation systems optimized for professional workloads.

  • Establish strategies to deliver quiet and thermally efficient systems without compromising performance.

  • Track industry trends and emerging technologies including CPU, GPU, memory, storage, cooling, power, and AI-accelerated computing solutions.

  • Champion innovative thermal and mechanical technologies that enhance user experience and system competitiveness.

Required Qualifications

  • Master's degree in Mechanical Engineering or related engineering discipline.

  • 10+ years of experience in mechanical and thermal product development.

  • 5+ years of people management experience leading engineering teams.

  • Experience developing desktop, workstation, server, or other high-performance computing systems.

  • Strong understanding of thermal management, acoustics, structural design, and manufacturing processes.

  • Proven experience leading cross-functional product development programs from concept to production.

  • Demonstrated ability to build and develop high-performing engineering teams.

Preferred Qualifications

  • Experience integrating third-party turnkey technologies into commercial products.

  • Knowledge of CPU/GPU performance optimization, power management, and platform architecture.

  • Familiarity with thermal simulation tools, reliability testing, and acoustic engineering.

  • Experience working with global engineering teams, ODM/JDM partners, and component suppliers.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Taiwan)

Travel -

Relocation -

Equal Opportunity Employer (EEO)-

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’sEEO Policy or read about your rights as an applicant under the law here: “ Know Your Rights: Workplace Discrimination is Illegal "

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