{"id":1140324,"url":"https://alion.io/job/huawei-engineer-6g-rf-packaging","title":"Engineer - 6G RF Packaging","company":{"id":1051095,"name":"CMC Microsystems","domain":"cmc.ca","url":"https://alion.io/company/cmc-ca","size_band":"501-1000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Recruitee","truth_index":{"grade":"B","score":84,"open_postings":158,"ghost_share":0.19,"stale_share":0,"repost_share":0,"time_to_fill_p50_days":155,"computed_at":"2026-10-06T05:45:30Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"explicit","locations":["Ottawa, Canada"],"countries":["CA"],"hiring_countries":[],"hiring_countries_total":0,"salary":{"min":106000,"max":null,"currency":"CAD","period":"year","gross":null,"usd_annual":74461},"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-11T11:57:16Z","employer_posted_date":"2026-09-11","last_verified_at":"2026-10-06T22:03:33Z","board_verified":true,"closed_at":null,"days_open":25,"trust":{"level":"ok","repost_count":1,"flags":["company_stale"],"days_open":24},"description":"Huawei Canada has an immediate permanent opening for an Engineer.\nAbout the team:\nWelcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions.\nAbout the job:\nExplore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.\n\nStudy low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.\n\nDevelop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.\n\nInvestigate additively manufactured RF structures and engineered materials for prototyping advantages.\n\nPerform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.\n\nDesign package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.\n\nCoordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.\n\nPartner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.\n\nSecure patents and invention disclosures while publishing papers and internal technical reports.\n\nThe total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise.\nRequirements\nAbout the ideal candidate:\n5 years of relevant industry experiences.\n\nPhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).\n\nDeep knowledge of RF/microwave principles.\n\nExperience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.\n\nHands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding).\n\nProficiency with RF lab equipment (VNAs), probe station.\n\nWorking knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.\n\nAdditional Information:\nHuawei Canada is committed to a fair, inclusive, and accessible recruitment process. If you require accommodation during any stage of the hiring process, please let us know and we will work with you to meet your needs.\nAll applications for this position are reviewed directly by our hiring team, we do not use artificial intelligence tools to screen or select candidates.","description_format":"text","description_chars":2655,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[{"name":"Canada","iso":"CA","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Research Institutes","Semiconductor IP & Chip Design Services"],"lifecycle":[{"event":"open","at":"2026-09-23T10:47:22Z"},{"event":"close","at":"2026-09-26T14:43:21Z"},{"event":"reopen","at":"2026-10-02T10:11:12Z"}],"visa":[],"liveness":{"score":90,"band":"hot","label":"Hiring now","p_open":1,"p_active":0.898,"p_room":1,"age_days":24,"expected_fill_days":155,"reasons":["conf:0","velocity","win:early","comp:brand"],"computed_at":"2026-10-06T05:45:30Z"},"pay":{"stated_usd_annual":74461,"is_top_pay":false},"html_url":"https://alion.io/job/huawei-engineer-6g-rf-packaging","json_url":"https://alion.io/job/huawei-engineer-6g-rf-packaging.json","meta":{"generated_at":"2026-10-07T00:21:17Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":535,"day_limit":5000,"remaining_today":4465,"minute_limit":60,"resets_at":"2026-10-08T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":1051095},"rest":"https://alion.io/mcp/rest/get_company?id=1051095"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fhuawei-engineer-6g-rf-packaging"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fhuawei-engineer-6g-rf-packaging"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fhuawei-engineer-6g-rf-packaging"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/huawei-engineer-6g-rf-packaging\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fhuawei-engineer-6g-rf-packaging"}]}