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Salary
≈ $25k – $54k per year (Estimated)
Location
In office (Shanghai)
Seniority
Middle · 3+ years exp
Employment
Full-Time

Confirmed on the employer's own hiring board on Oct 12, 2026. First seen by Alion on Apr 29, 2026. ThunderSoft scores D on the Alion truth index.

Overview
Company
Impact
Profile match
ThunderSoft is a Chinese operating system and edge intelligence software company headquartered in Beijing that builds embedded platforms for smartphones, vehicles, robots and IoT devices. Founded in 2008 and listed on the Shenzhen Stock Exchange, it works closely with chipmakers such as Qualcomm and runs development centers in Shanghai, Chengdu, Nanjing, Shenzhen and Wuhan, with subsidiaries including Thundercomm and offices in the US, Europe and Asia. It hires embedded software and Linux engineers, firmware and system test engineers, hardware, layout and thermal engineers, and presales product managers.

岗位职责 / Responsibilities

1、负责新产品热设计方案制定与仿真评估,基于整机功耗、器件布局、结构限制,输出散热架构方案与热仿真报告。

2、独立使用 **CFD 热仿真工具(Flotherm/Icepak)** 完成板级 / 整机级热仿真建模、网格优化、温度场 / 流场分析,识别热点与散热瓶颈并提出优化措施。

3、主导散热方案设计与器件选型:散热器、热管 / VC、风扇、导热界面材料(导热垫 / 硅脂)、均温板等,完成结构布局与风道设计。

4、制定热测试方案并组织验证:使用热电偶、红外热像仪、风洞、噪声测试设备等,完成温升、热阻、风量、噪音测试; 对比仿真与测试数据,校准模型并闭环优化。

5、跟进产品全生命周期热相关问题:解决 EVT/DVT/ 量产阶段温升、过热、降频、噪音超标等问题,输出根因分析与整改方案。

6、与结构、硬件、电子、供应商紧密协作,完成散热件打样、签样、可靠性测试及认证配合; 输出热设计规范、BOM 与技术协议。

7、跟踪行业热管理新技术、新材料、新工艺(如液冷、相变材料、新型导热材料),开展预研与技术储备。

任职要求 / Requirements

学历与专业:本科及以上学历,热能与动力工程、工程热物理、流体力学、机械工程等相关专业。

工作经验:3 年及以上电子 / 整机热设计经验,有笔记本、服务器、消费电子、通信设备或车载电子热设计经验优先。

理论基础:扎实的传热学、工程热力学、流体力学基础,熟练掌握热传导、对流、辐射及热界面基本原理。

仿真能力:精通至少一款主流热仿真软件(Flotherm 优先,或 Icepak/Fluent),能独立完成复杂整机建模、简化与仿真优化。

设计与测试:熟悉常用导热材料、散热器加工工艺、风扇选型与噪音控制,风冷、热管 / VC、自然对流等主流散热技术及设计要点

软件技能:会使用Creo/ProE等 3D 软件进行简单结构建模与散热件设计; 会使用 Office 输出专业技术报告。

职业素养:具备良好的系统思维、问题驱动与闭环意识; 沟通协作能力强,能跨部门推动问题解决; 能承受多项目并行压力,执行力强。

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