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Salary
≈ $32k – $62k per year (Estimated)
Location
Hybrid (Singapore)
Seniority
Intern
Employment
Internship

Confirmed on the employer's own hiring board on Sep 27, 2026. First seen by Alion on Jul 16, 2026. Infineon Technologies scores B on the Alion truth index.

Overview
Company
Impact
Profile match
Infineon Technologies is a semiconductor company near Munich that was spun out of Siemens in 1999. It is the world leader in power semiconductors and a major supplier of automotive chips, security controllers and sensors. The company operates fabrication plants in Germany, Austria and Malaysia and is building a large new site in Dresden.
The student, gets to work with our global team on package design and selection process. He/she will work to analyse and make digitalisation of the package assembly database. Student will also spearhead the platform to enable good selection of package for efficient customer design acceptance and build an application for package information and analysis.

Your Role

Key responsibilities in your new role

  • Package Requirements Understanding: Understand the criteria in a package, electrically, structurally, quality standard governing the application.
  • Data Analysis: Conduct in-depth analysis of large and complex datasets to extract meaningful package concept in technology & assembly for decision-making.
  • Data Collection & Organization: Collect, clean, and organize data from various sources for analysis.
  • Dashboard Development: Work on a dashboard for package selection.
  • App Development: Build a handphone app for package info retrieval.

Internship Learning Outcomes:

  • Advanced Packaging Concepts: Concept and design of advanced packaging in specific automotive solutions.
  • End-to-End Product Exposure: Experience the fast pace and dynamic conceptualisation of a package from design to ramp up phase.
  • Global Team Collaboration: Exposure to various expert team and the team work to realise a final product in a global setting.
  • Career Preparation: Integrate into new package design and launch in the competitive packaging assembly environment.

Your Profile

Qualifications and skills to help you succeed

  • Education: Bachelor's/ Masters' pursuing engineering studies.
  • Semiconductor Fundamentals: Basic technical understanding of semiconductor material / process / technology.
  • Analytical Capability: Experience with complex dataset, with good analytical mindset.
  • Digital/Programming Exposure: Academic exposure in AI, digitalisation or programming languages (preferred).
  • Initiative & Adaptability: Able to handle changes, take initiative to make solution proposal.
  • Self-Management: Self motivated, highly organised, able to manage task independently.
  • Preferred Intake: Jan 27 - May/June 27.

Contact:

Hillary Woo

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

Click here for more information about Diversity & Inclusion at Infineon.

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