{"id":1241257,"url":"https://alion.io/job/infineon-technologies-lead-principal-engineer-package-definition","title":"Lead Principal Engineer Package Technology","company":{"id":51757,"name":"Infineon Technologies","domain":"infineon.com","url":"https://alion.io/company/infineon-technologies","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":82,"open_postings":203,"ghost_share":0,"stale_share":0.724,"repost_share":0,"time_to_fill_p50_days":54,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Malacca, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":18000,"max_usd":44000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":1961},"experience_years_min":7,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AutoCAD","optional":false}],"status":"live","first_seen_at":"2026-08-21T10:00:20Z","employer_posted_date":"2026-10-28","last_verified_at":"2026-10-30T17:21:19Z","board_verified":true,"closed_at":null,"days_open":70,"trust":{"level":"ok","repost_count":1,"flags":[],"days_open":68},"description":"Join Infineon as a Lead Principal Engineer Package Technology and drive innovation in advanced semiconductor packaging solutions. In this strategic technical leadership role, you will define and develop future package technologies, lead innovation initiatives, influence technology roadmaps, and collaborate with global stakeholders to deliver cutting-edge packaging solutions from concept to industrialization.\nYour role\nKey responsibilities in your new role\nDrive the innovation, definition, and development of advanced package technologies and solutions for new products, from concept feasibility through industrialization.\n\nProactively identify industry trends and emerging technologies in package innovation, supporting feasibility assessments and strategic technology planning.\nFacilitate and promote innovation within the organization by coaching teams, challenging conventional approaches, and balancing technical risks with business opportunities.\nContribute to technology roadmaps, standards development, and long-term business strategies aligned with industry requirements and market trends.\nSupport intellectual property (IP) strategy development by identifying innovation opportunities, generating patents, and enhancing technical reputation through publications and technical presentations.\nMake key technical decisions within the business and functional areas while taking ownership of implementation and execution activities.\nLead package innovation projects and development activities across global cross-functional teams to ensure successful technology deployment.\nBenchmark competitor and subcontractor package technologies to maintain and strengthen Infineon's technology leadership position.\nInvestigate and evaluate new technologies, materials, and packaging concepts while actively managing associated technical risks.\nServe as the technical authority for package technology innovation and provide expert guidance to stakeholders, project teams, and engineering organizations.\nMentor and develop engineers by sharing technical knowledge, best practices, and innovation methodologies.\nDrive measurable business impact through technology leadership, innovation implementation, and successful execution of strategic initiatives.\nYour profile\nQualifications and skills to help you succeed \nA Bachelor's Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics, Physics, or a related discipline.\n\nMinimum 7 years of relevant experience in the semiconductor, IC packaging, SMT, assembly, or test manufacturing environment.\nStrong knowledge of Semiconductor Packaging, Surface Mount Technology (SMT), Assembly, and Test processes.\nSolid understanding of Process Engineering and Equipment Engineering within semiconductor manufacturing.\nExperience in Failure Analysis, Reliability Engineering, and root cause investigation methodologies.\nStrong analytical thinking, technical problem-solving, and decision-making capabilities.\nExperience leading technology innovation initiatives, technical projects, and cross-functional engineering teams.\nProven ability to develop technology roadmaps, conduct feasibility studies, and drive technology implementation.\nKnowledge of intellectual property development, patent generation, and technology benchmarking is an added advantage.\nProficiency in AutoCAD and 3D drafting tools is preferred.\nExcellent communication and stakeholder management skills, with the ability to influence technical and business decisions across organizational levels.\nStrong mentoring and coaching abilities with a passion for developing engineering talent.\nA proactive, innovative, and results-oriented mindset with a strong sense of ownership and accountability.\n#WeAreIn for driving decarbonization and digitalization.\nAs a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.\nAre you in?\nWe are on a journey to create the best Infineon for everyone.\nWe strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.\nOur hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.\nPlease let your recruiter know if you need any accommodations during the interview process.\nLearn more about our various contact channels and about Diversity & Inclusion at Infineon.","description_format":"text","description_chars":4818,"description_truncated":false,"requirements":{"experience_years_min":7,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-09-25T16:39:36Z"},{"event":"reopen","at":"2026-10-28T03:27:55Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 259 · green card filings: 8","filings_12m":259,"filings_prev_12m":50,"green_card_filings_12m":8,"median_offered_wage_usd":156301,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0},{"country":"GB","licensed_sponsor":true,"evidence":"Licensed UK visa sponsor (Senior or Specialist Worker, Skilled Worker)","filings_12m":null,"filings_prev_12m":null,"green_card_filings_12m":null,"median_offered_wage_usd":null,"route":"Global Business Mobility: Senior or Specialist Worker; 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