{"id":3377628,"url":"https://alion.io/job/infineon-technologies-lead-principal-engineer-technology-integration","title":"Lead Principal Engineer Technology Integration","company":{"id":51757,"name":"Infineon Technologies","domain":"infineon.com","url":"https://alion.io/company/infineon-technologies","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":82,"open_postings":203,"ghost_share":0,"stale_share":0.724,"repost_share":0,"time_to_fill_p50_days":54,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"lead","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Malacca, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":5,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false}],"status":"live","first_seen_at":"2026-08-21T10:00:37Z","employer_posted_date":"2026-10-28","last_verified_at":"2026-10-30T21:49:41Z","board_verified":true,"closed_at":null,"days_open":70,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":70},"description":"Join our Technology Integration organization as a Lead Principal Engineer and serve as a technical leader in the development and industrialization of advanced semiconductor package technologies. In this highly influential role, you will drive technology integration strategies, lead risk assessment and mitigation activities, and provide expert guidance on Front-End (FE) and Back-End (BE) process interactions. You will work across global cross-functional teams to ensure robust technology readiness, successful package platform development, and seamless integration of innovative semiconductor solutions.\nYour role\nKey responsibilities in your new role\nLead Package Business Case (PBC) and Technology Project Case (TPC) assessments, providing technical evaluations, integration readiness assessments, and risk mitigation recommendations.\n\nDrive Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities to systematically identify, assess, and mitigate technology and process-related risks.\nOwn and lead risk interaction assessment and mitigation work packages, ensuring potential process and material interactions are identified and addressed early in development.\nDrive the integration of unit processes, Bills of Materials (BOM), and process flows within package platforms, including interaction studies, process compatibility assessments, and manufacturing risk evaluations.\nAct as the key technical partner for Front-End (FE) and Back-End (BE) integration activities, supporting FE/BE and BE/BE interaction topics throughout product and technology development.\nSupport pre-development initiatives for emerging chip and package technologies through feasibility assessments, technology evaluations, and integration studies.\nLead or contribute to structured problem-solving activities using methodologies such as 8D, Fishbone Analysis, Fault Tree Analysis (FTA), and Root Cause Analysis (RCA) to resolve technology interaction issues.\nAssess the impact of package design rules and process requirements on inter-process interactions, product performance, manufacturability, and reliability.\nProvide subject matter expertise, technical guidance, and mentorship to project teams on technology integration, process interactions, and risk management topics.\nCollaborate with development, process engineering, reliability, assembly, test, and manufacturing teams to ensure successful implementation of advanced package technologies.\nYour profile\nQualifications and skills to help you succeed \nBachelor's Degree in Engineering, Materials Science, Microelectronics, Semiconductor Technology, Mechanical Engineering, Electrical Engineering, Electronics Engineering, Physics, or a related discipline.\n\nMinimum 5 years of experience in semiconductor manufacturing, package development, technology integration, assembly, SMT, or related engineering functions.\nStrong knowledge of Semiconductor Packaging, Surface Mount Technology (SMT), assembly processes, and technology integration principles.\nProven experience in technical problem-solving and root cause analysis within semiconductor manufacturing or advanced packaging environments.\nSolid understanding of process interactions, material compatibility, manufacturing risks, and technology qualification methodologies.\nStrong communication, collaboration, and stakeholder management skills with the ability to influence decisions across multidisciplinary teams.\n#WeAreIn for driving decarbonization and digitalization.\nAs a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.\nAre you in?\nWe are on a journey to create the best Infineon for everyone.\nWe strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.\nOur hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.\nPlease let your recruiter know if you need any accommodations during the interview process.\nLearn more about our various contact channels and about Diversity & Inclusion at Infineon.","description_format":"text","description_chars":4454,"description_truncated":false,"requirements":{"experience_years_min":5,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-28T03:27:55Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 259 · green card filings: 8","filings_12m":259,"filings_prev_12m":50,"green_card_filings_12m":8,"median_offered_wage_usd":156301,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0},{"country":"GB","licensed_sponsor":true,"evidence":"Licensed UK visa sponsor (Senior or Specialist Worker, Skilled Worker)","filings_12m":null,"filings_prev_12m":null,"green_card_filings_12m":null,"median_offered_wage_usd":null,"route":"Global Business Mobility: Senior or Specialist Worker; 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