{"id":2987081,"url":"https://alion.io/job/infineon-technologies-senior-staff-engineer-module-package-development","title":"Senior Staff Engineer Module Package Development","company":{"id":51757,"name":"Infineon Technologies","domain":"infineon.com","url":"https://alion.io/company/infineon-technologies","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":81,"open_postings":203,"ghost_share":0,"stale_share":0.759,"repost_share":0,"time_to_fill_p50_days":53,"computed_at":"2026-10-23T05:54:15Z"}},"role":"Backend","role_family":"Backend","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Muntinlupa, Philippines"],"countries":["PH"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":28000,"max_usd":60000,"period":"year","method":"global_role_cell_scaled_by_country","sample_n":2286},"experience_years_min":7,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AutoCAD","optional":false},{"name":"HPC","optional":false},{"name":"JMP","optional":false},{"name":"Minitab","optional":false}],"status":"live","first_seen_at":"2026-10-19T08:46:27Z","employer_posted_date":"2026-10-21","last_verified_at":"2026-10-23T13:11:29Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"Shape the future of semiconductor packaging for AI and High-Performance Computing.\nWe’re looking for a Senior Staff Engineer to develop next-generation package concepts for AI power-supply and HPC applications. You’ll lead package definition from concept to product release, working across Back-End assembly, OSAT partners, simulation, reliability, SMT and module technologies.\nIf you bring deep expertise in semiconductor packaging and assembly and want to turn innovative concepts into high-performance solutions, this could be your next opportunity.\nYour role\nKey responsibilities in your new role\nDevelop and define package concepts for AI power-supply products, with an emphasis on High-Performance Computing (HPC) modules.\n\nValidate proposed package concepts through simulation and hardware demonstrators, working closely with Back-End development, product development, and system architects.\n\nCoordinate and align new package concepts with Back-End development teams, including internal teams and OSAT partners, and launch required assembly projects.\n\nTrack and support package development projects through to final product release.\n\nIdentify emerging development needs and translate them into additions or updates to the package roadmap.\n\nServe as the technical point of contact for customer questions related to semiconductor packaging.\n\nStay current on packaging solutions by continuously monitoring market trends and conducting competitor benchmarking.\n\nIdentify and assess business opportunities created by new technologies and innovative packaging concepts.\n\nLead the technical definition for major and new package projects, including BOM, package design, assembly technology selection, PRP reviews, and project classification, as well as risk and impact assessment.\n\nDefine package characteristics that satisfy electrical, thermal, mechanical, and reliability requirements.\n\nAct as a key technical interface to partners and technical consultants on package definition, particularly in Back-End assembly technology.\n\nSupport pre-development and project definition activities, and serve as the packaging design expert throughout the full project lifecycle.\n\nYour profile\nQualifications and skills to help you succeed\nBachelor’s degree in Engineering (e.g., Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Applied Physics) with ~7+ years of relevant experience in assembly technologies.\nStrong hands-on knowledge of Back-End processes, materials, and interdependencies (including laminate design, materials, and manufacturing processes).\nWorking knowledge of SMT, PCB/module-related technologies and Mechanical\nAdditional knowledge of passive components, including MLCCs, is an advantage.\nExpertise in semiconductor packaging, assembly, and test.\nExperience with failure analysis and reliability engineering.\nStrong analytical, statistical ( JMP, Minitab), and structured problem-solving skills.\nAutoCAD and 3D drafting skills preferred.\nExcellent communication and presentation skills, must be able to communicate effectively English both verbally and in writing.\n#WeAreIn for driving decarbonization and digitalization.\nAs a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.\nAre you in?\nWe are on a journey to create the best Infineon for everyone.\nWe strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.\nOur hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.\nPlease let your recruiter know if you need any accommodations during the interview process.\nLearn more about our various contact channels and about Diversity & Inclusion at Infineon.\nMandy Neoh","description_format":"text","description_chars":4149,"description_truncated":false,"requirements":{"experience_years_min":7,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"All levels","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-21T08:43:35Z"}],"visa":[],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":3,"expected_fill_days":53,"reasons":["conf:2","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-23T05:54:15Z"},"pay":null,"html_url":"https://alion.io/job/infineon-technologies-senior-staff-engineer-module-package-development","json_url":"https://alion.io/job/infineon-technologies-senior-staff-engineer-module-package-development.json","meta":{"generated_at":"2026-10-23T16:57:19Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":25687,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-24T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":51757},"rest":"https://alion.io/mcp/rest/get_company?id=51757"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Finfineon-technologies-senior-staff-engineer-module-package-development"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Finfineon-technologies-senior-staff-engineer-module-package-development"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Finfineon-technologies-senior-staff-engineer-module-package-development"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/infineon-technologies-senior-staff-engineer-module-package-development\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Finfineon-technologies-senior-staff-engineer-module-package-development"}]}