{"id":4005319,"url":"https://alion.io/job/infineon-technologies-senior-staff-engineer-package-technology-development-3","title":"Senior Staff Engineer Package Technology Development","company":{"id":51757,"name":"Infineon Technologies","domain":"infineon.com","url":"https://alion.io/company/infineon-technologies","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":80,"open_postings":193,"ghost_share":0,"stale_share":0.777,"repost_share":0.005,"time_to_fill_p50_days":56,"computed_at":"2026-11-14T05:58:10Z"}},"role":"Backend","role_family":"Backend","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Malacca, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":7,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false}],"status":"live","first_seen_at":"2026-11-10T01:46:14Z","employer_posted_date":"2026-11-10","last_verified_at":"2026-11-14T21:03:52Z","board_verified":true,"closed_at":null,"days_open":4,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":4},"description":"Join our Package Technology Development team and play a key role in driving the development, integration, and qualification of advanced semiconductor package technologies. As a Senior Staff Engineer, you will lead technology risk assessments, package integration activities, and cross-functional collaboration efforts to ensure robust package development and successful industrialization of new semiconductor products.\nYour role\nKey responsibilities in your new role\nDrive Package Business Case (PBC) and Technology Project Case (TPC) assessments, ensuring technical feasibility, manufacturability, and technology readiness for new package developments.\n\nLead Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities and drive proactive risk identification, assessment, and mitigation strategies throughout the development lifecycle.\nOwn risk interaction assessments and mitigation work packages related to package technologies, materials, process integration, and manufacturing readiness.\nDrive the integration of unit processes, Bills of Materials (BOM), and process flows within package platforms, including assessment of inter-process interactions and technology compatibility.\nAct as the key technical partner for Front-End (FE) and Back-End (BE) interaction topics, ensuring successful technology integration across development and manufacturing environments.\nSupport pre-development activities for next-generation chip and package technologies through feasibility studies, risk assessments, and technology evaluations.\nLead or participate in 8D investigations, root cause analysis activities, and technical problem-solving task forces related to package interaction and integration challenges.\nEvaluate the impact of package design rules on process interactions, manufacturability, quality, and reliability performance.\nProvide technical guidance, consultation, and mentoring to project teams and stakeholders on package technology development and integration topics.\nCollaborate with global cross-functional teams to ensure successful project execution, technology qualification, and product release.\nYour profile\nQualifications and skills to help you succeed \nMinimum Bachelor's Degree in Semiconductor Technology, Microelectronics, Automation Engineering, Mechanical Engineering, Electrical Engineering, Electronics Engineering, Physics, or a related engineering discipline.\n\nMinimum 7 years of relevant experience within the IC or semiconductor industry, preferably in Package Development, Process Integration, Technology Development, Assembly, or Manufacturing Engineering.\nStrong knowledge of semiconductor packaging technologies, assembly processes, process integration, and package development methodologies.\nExperience conducting technical risk assessments, DFMEA activities, process interaction studies, and technology qualification projects.\nStrong analytical, troubleshooting, and problem-solving capabilities with the ability to resolve complex technology integration challenges.\nExcellent communication and stakeholder management skills with the ability to work effectively across global, cross-functional, and cross-site teams.\n#WeAreIn for driving decarbonization and digitalization.\nAs a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.\nAre you in?\nWe are on a journey to create the best Infineon for everyone.\nWe strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.\nOur hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.\nPlease let your recruiter know if you need any accommodations during the interview process.\nLearn more about our various contact channels and about Diversity & Inclusion at Infineon.","description_format":"text","description_chars":4199,"description_truncated":false,"requirements":{"experience_years_min":7,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-11-10T06:44:51Z"}],"visa":[{"country":"US","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"H-1B filings in 12 months: 259 · green card filings: 8","filings_12m":259,"filings_prev_12m":50,"green_card_filings_12m":8,"median_offered_wage_usd":156301,"route":null,"cap_exempt":false,"checked_at":"2026-11-14T07:33:33+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16},{"country":"IE","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"Irish employment permits in 12 months: 1","filings_12m":1,"filings_prev_12m":3,"green_card_filings_12m":null,"median_offered_wage_usd":null,"route":"Employment permits","cap_exempt":false,"checked_at":"2026-11-14T07:33:33+00:00","sources":["Department of Enterprise, Trade and Employment: employment permits issued to companies"],"filings_for_role_12m":0},{"country":"GB","licensed_sponsor":true,"adverts_offering_sponsorship_24m":0,"sanctioned_now":false,"evidence":"Licensed UK visa sponsor (Senior or Specialist Worker, Skilled Worker)","filings_12m":null,"filings_prev_12m":null,"green_card_filings_12m":null,"median_offered_wage_usd":null,"route":"Global Business Mobility: Senior or Specialist Worker; 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