{"id":3377630,"url":"https://alion.io/job/infineon-technologies-senior-staff-engineer-technology-integration-3","title":"Senior Staff Engineer Technology Integration","company":{"id":51757,"name":"Infineon Technologies","domain":"infineon.com","url":"https://alion.io/company/infineon-technologies","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":82,"open_postings":203,"ghost_share":0,"stale_share":0.724,"repost_share":0,"time_to_fill_p50_days":54,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Malacca, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":10,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"FMEA","optional":false}],"status":"live","first_seen_at":"2026-08-20T13:00:34Z","employer_posted_date":"2026-10-28","last_verified_at":"2026-10-30T17:21:19Z","board_verified":true,"closed_at":null,"days_open":71,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":71},"description":"Join our Technology Integration team and play a critical role in enabling the successful development and industrialization of advanced semiconductor package technologies. As a Senior Staff Engineer, you will be responsible for driving technology integration activities across package platforms, identifying and mitigating process interaction risks, and ensuring seamless integration between Front-End (FE) and Back-End (BE) technologies. You will work closely with cross-functional engineering teams to conduct risk assessments, lead technical problem-solving initiatives, and support the development of innovative semiconductor packaging solutions.\nYour role\nKey responsibilities in your new role\nLead Package Business Case (PBC) and Technology Project Case (TPC) assessments by evaluating technical feasibility, risks, and integration readiness of new package technologies.\n\nDrive Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities to identify, assess, and mitigate technical risks throughout the product development lifecycle.\nOwn risk interaction assessments and mitigation work packages, ensuring systematic identification and resolution of integration challenges across technologies and processes.\nLead the integration of unit processes, Bill of Materials (BOM), and process flows within package platforms while assessing interdependencies, compatibility, and manufacturing risks.\nAct as the key technical interface for Front-End (FE) and Back-End (BE) interaction topics, ensuring alignment and successful technology integration across development and manufacturing organizations.\nSupport pre-development activities for new chip technologies through early risk assessments, technology evaluations, and integration studies.\nLead or actively contribute to structured problem-solving activities, including 8D investigations, root cause analysis, and corrective actions for inter-process interaction issues.\nAssess the impact of package and design rules on process interactions, manufacturability, reliability, and overall technology performance.\nProvide technical guidance, coaching, and consultation to project teams on technology integration, interaction risks, and package development challenges.\nCollaborate with cross-functional stakeholders across Package Development, Process Engineering, Manufacturing, Quality, Reliability, and Product Development to ensure successful project execution.\nYour profile\nQualifications and skills to help you succeed \nBachelor's Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation Engineering, Mechanical Engineering, Electrical Engineering, Electronics Engineering, Physics, or a related discipline.\n\nMinimum 10 years of experience in the semiconductor industry with strong exposure to semiconductor package development, technology integration, assembly, and test processes.\nSolid understanding of semiconductor packaging technologies, assembly processes, test operations, and package platform development.\nStrong knowledge of Front-End (FE) to Back-End (BE) interactions, as well as Back-End to Back-End process integration and technology interactions.\nProven experience leading technical risk assessments, DFMEA activities, integration studies, and engineering problem-solving initiatives.\nStrong analytical, troubleshooting, and decision-making skills with the ability to evaluate complex technical interactions and drive effective solutions.\n#WeAreIn for driving decarbonization and digitalization.\nAs a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.\nAre you in?\nWe are on a journey to create the best Infineon for everyone.\nWe strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.\nOur hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.\nPlease let your recruiter know if you need any accommodations during the interview process.\nLearn more about our various contact channels and about Diversity & Inclusion at Infineon.","description_format":"text","description_chars":4485,"description_truncated":false,"requirements":{"experience_years_min":10,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":true},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-28T03:27:55Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 259 · green card filings: 8","filings_12m":259,"filings_prev_12m":50,"green_card_filings_12m":8,"median_offered_wage_usd":156301,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0},{"country":"GB","licensed_sponsor":true,"evidence":"Licensed UK visa sponsor (Senior or Specialist Worker, Skilled Worker)","filings_12m":null,"filings_prev_12m":null,"green_card_filings_12m":null,"median_offered_wage_usd":null,"route":"Global Business Mobility: Senior or Specialist Worker; 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