{"id":3448828,"url":"https://alion.io/job/infineon-technologies-senior-staff-engineer-unit-process-development-die-attach","title":"Senior Staff Engineer Unit Process Development Die Attach","company":{"id":51757,"name":"Infineon Technologies","domain":"infineon.com","url":"https://alion.io/company/infineon-technologies","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":81,"open_postings":194,"ghost_share":0,"stale_share":0.753,"repost_share":0,"time_to_fill_p50_days":54,"computed_at":"2026-11-01T06:10:25Z"}},"role":"Backend","role_family":"Backend","seniority":"staff","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Malacca, Malaysia"],"countries":["MY"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":null,"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"FMEA","optional":false}],"status":"live","first_seen_at":"2026-08-10T10:00:30Z","employer_posted_date":"2026-10-29","last_verified_at":"2026-11-01T03:55:35Z","board_verified":true,"closed_at":null,"days_open":82,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":82},"description":"Join our Unit Process Development team as a Senior Staff Engineer specializing in Die Attach technology. In this role, you will be responsible for driving the development, optimization, qualification, and industrialization of die attach processes for advanced semiconductor packages. You will lead process innovation initiatives, solve complex technical challenges, and collaborate closely with cross-functional teams, suppliers, and manufacturing sites to ensure robust, cost-effective, and manufacturable process solutions. As a technical expert, you will play a key role in shaping future process technologies and supporting new product development programs.\nYour role\nKey responsibilities in your new role\nLead process development activities for Die Attach technologies, including process parameter scouting, optimization, verification, qualification, and process freeze to meet project objectives in quality, cost, manufacturability, and timeline.\n\nDrive technical handover and knowledge transfer activities from development to manufacturing operations, ensuring successful process implementation and production readiness.\nSupport prototype builds, engineering samples, and development projects while ensuring process stability and technical compliance throughout the development cycle.\nDevelop, maintain, and review technical documentation including Process Specifications, PFMEA, DFMEA, OJTI, T32, PDR, and other engineering records.\nProvide technical ownership and input for Process of Record (POR), Assembly Design Rules, Process Roadmaps, Control Plans, Failure Catalogues, and Maintenance Checklists.\nCollaborate with equipment, tooling, and material suppliers to evaluate, verify, qualify, and implement new technologies, machines, tooling solutions, and materials.\nLead task forces and multidisciplinary teams in resolving complex manufacturing and process-related challenges using structured problem-solving methodologies and statistical tools.\nIdentify and develop next-generation Die Attach process technologies and continuously improve process capability to support future business and product requirements.\nSupport technology selection and definition activities involving materials, equipment platforms, tooling concepts, and process architectures.\nProvide technical coaching, mentorship, and guidance to engineers, project teams, and stakeholders on Die Attach process technologies and best practices.\nYour profile\nQualifications and skills to help you succeed \nMaster's or Bachelor's Degree in Engineering, Materials Science, Chemical Engineering, Semiconductor Technology, Microelectronics, Mechanical Engineering, Electrical Engineering, or a related technical discipline.\n\nMinimum 8 years of experience in the semiconductor manufacturing industry, with strong exposure to assembly process development and semiconductor packaging technologies.\nStrong hands-on knowledge and expertise in semiconductor assembly processes, particularly Die Attach technologies, materials, equipment, and process integration.\nSolid understanding of material science principles, chemical interactions, and process-material relationships within semiconductor manufacturing environments.\nStrong analytical and problem-solving skills with the ability to diagnose complex process issues and drive effective corrective and preventive solutions.\nExperience with statistical analysis and data-driven decision-making, including Design of Experiments (DOE), process characterization, and process optimization methodologies.\n#WeAreIn for driving decarbonization and digitalization.\nAs a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.\nAre you in?\nWe are on a journey to create the best Infineon for everyone.\nWe strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.\nOur hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.\nPlease let your recruiter know if you need any accommodations during the interview process.\nLearn more about our various contact channels and about Diversity & Inclusion at Infineon.","description_format":"text","description_chars":4543,"description_truncated":false,"requirements":{"experience_years_min":8,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Analog & Power Semiconductors"],"lifecycle":[{"event":"open","at":"2026-10-29T10:06:21Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 259 · green card filings: 8","filings_12m":259,"filings_prev_12m":50,"green_card_filings_12m":8,"median_offered_wage_usd":156301,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":16},{"country":"GB","licensed_sponsor":true,"evidence":"Licensed UK visa sponsor (Senior or Specialist Worker, Skilled Worker)","filings_12m":null,"filings_prev_12m":null,"green_card_filings_12m":null,"median_offered_wage_usd":null,"route":"Global Business Mobility: Senior or Specialist Worker; 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