{"id":1322043,"url":"https://alion.io/job/infineon-technologies-soc-hw-systems-engineer-packaging-io","title":"SoC HW Systems Engineer — Packaging & IO","company":{"id":51757,"name":"Infineon Technologies","domain":"infineon.com","url":"https://alion.io/company/infineon-technologies","size_band":"1001-5000","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Eightfold","truth_index":{"grade":"B","score":81,"open_postings":208,"ghost_share":0,"stale_share":0.74,"repost_share":0,"time_to_fill_p50_days":54,"computed_at":"2026-10-21T05:46:15Z"}},"role":"Hardware","role_family":"Hardware","seniority":"senior","employment_type":null,"work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Bengaluru, India"],"countries":["IN"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":17000,"max_usd":43000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":18},"experience_years_min":7,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-06-12T12:00:30Z","employer_posted_date":"2026-08-19","last_verified_at":"2026-10-21T08:43:35Z","board_verified":true,"closed_at":null,"days_open":131,"trust":{"level":"ok","repost_count":0,"flags":[],"days_open":130},"description":"Our Automotive Microcontroller R&D team\nis looking for an experienced SoC HW Systems Engineer to join the Chip-Level\nArchitecture team and own the package, ballout, and IO interface strategy for\nour next-generation automotive microcontroller platform.\nYour role\nKey responsibilities in your new role\n·Own the package selection\nstrategy, ballout architecture, and IO ring planning for our next-generation uC\nplatform.\n·Analyze and consolidate\ncustomer PCB design constraints and system-level integration requirements to\ndrive chip-level packaging decisions.\n·Review and maintain the\nplatform ballout map, providing technical feedback across stakeholder teams\nincluding implementation, PHY vendors, and customers.\n·Drive the datasheet content for\nIO electrical parameters and system-level interface specifications in\ncollaboration with IP teams and customers.\n·Verify PHY and PMIC\ncompatibility with the platform through model-based simulation and parasitic\nanalysis.\n·Assess package performance vs.\ncost tradeoffs and maintain the holistic picture of package constraints versus\ncustomer system needs across the full product family.\n·Maintain technical\ndocumentation in compliance with ISO 26262 requirements.\nYour profile\nQualifications and skills to help you succeed \n·Bachelor's or Master's degree\nin Electrical Engineering or related field.\n·At least 7 years of industry\nexperience in semiconductor product development with a background in analog\ndesign, package engineering, or SoC system-level design.\n·Good knowledge of package types\n(LFBGA, TFBGA, QFP) and package parasitic modeling.\n·Experience with PCB\nsystem-level design constraints and customer board integration requirements.\n·Understanding of IO ring\narchitecture - pad types, ESD protection strategies, IO power domains.\n·Familiarity with ballout\nplanning, signal grouping principles, and PCB routing constraints for\nautomotive microcontrollers.\n·Familiarity with ISO 26262\ndocumentation standards.\n·Pro-active collaborative\nattitude with strong communication skills in a global multi-cultural team.\n·Fluent English required; German\nis a plus.\nYou\nare best equipped for this task if you have:\n·Experience reviewing package\nroadmaps and translating customer system constraints into chip-level package\nand ballout requirements.\n·Hands-on experience with signal\nintegrity simulation at package level and model-based PHY/PMIC compatibility\nverification.\n·Contributed to ballout map\ncreation, reviewed platform ballout with stakeholders, and managed feedback\ncycles with package vendors.\n·Worked on datasheet electrical\nparameter content for IO and system-level interface specifications.\n·Experience driving BOM analysis\nfor the full system solution around the microcontroller.\n#WeAreIn for driving decarbonization and digitalization.\nAs a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.\nAre you in?\nWe are on a journey to create the best Infineon for everyone.\nWe strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.\nOur hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.\nPlease let your recruiter know if you need any accommodations during the interview process.\nLearn more about our various contact channels and about Diversity & Inclusion at Infineon.","description_format":"text","description_chars":3765,"description_truncated":false,"requirements":{"experience_years_min":7,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[{"language":"English","level":"Advanced (C1)","optional":false}]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Incident Response"],"lifecycle":[{"event":"open","at":"2026-09-26T21:59:02Z"}],"visa":[],"liveness":{"score":11,"band":"cold","label":"Long shot","p_open":1,"p_active":0.397,"p_room":0.28,"age_days":130,"expected_fill_days":54,"reasons":["conf:1","stale_co","velocity","win:tail","crowd:brand"],"computed_at":"2026-10-21T05:46:15Z"},"pay":null,"html_url":"https://alion.io/job/infineon-technologies-soc-hw-systems-engineer-packaging-io","json_url":"https://alion.io/job/infineon-technologies-soc-hw-systems-engineer-packaging-io.json","meta":{"generated_at":"2026-10-21T12:40:32Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":17918,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-22T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":51757},"rest":"https://alion.io/mcp/rest/get_company?id=51757"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Finfineon-technologies-soc-hw-systems-engineer-packaging-io"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Finfineon-technologies-soc-hw-systems-engineer-packaging-io"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Finfineon-technologies-soc-hw-systems-engineer-packaging-io"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/infineon-technologies-soc-hw-systems-engineer-packaging-io\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Finfineon-technologies-soc-hw-systems-engineer-packaging-io"}]}