{"id":3317025,"url":"https://alion.io/job/intel-advanced-packaging-development-engineer","title":"Advanced Packaging Development Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":85,"open_postings":92,"ghost_share":0.033,"stale_share":0.5,"repost_share":0.043,"time_to_fill_p50_days":30,"computed_at":"2026-10-30T05:48:23Z"}},"role":"Hardware","role_family":"Hardware","seniority":"middle","employment_type":"full_time","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":105000,"max_usd":202000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":664},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Design of Experiments","optional":false},{"name":"Statistical Process Control","optional":false},{"name":"MATLAB","optional":true},{"name":"Python","optional":true},{"name":"SQL","optional":true}],"status":"live","first_seen_at":"2026-10-26T00:00:00Z","employer_posted_date":"2026-10-26","last_verified_at":"2026-10-31T00:05:27Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Job Details:\nJob Description:\nThe Role and Impact \nAs a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor technologies. Your day-to-day responsibilities will include developing solutions to enhance reliability, manufacturability, and performance in high-volume manufacturing environments. These contributions will play a critical role in advancing Intel's leadership in semiconductor packaging technologies. \nBusiness Group \nThis role is part of Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) organization, which focuses on developing and scaling cutting-edge semiconductor packaging solutions. APTM supports Intel's broader mission by delivering technologies that empower high-performance, edge, and mobile computing applications, enabling global customer success and technological leadership. \nKey Responsibilities\nDevelop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.\nDrive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE).\nInnovate new techniques, materials, and tools to address emerging challenges in packaging reliability and manufacturability.\nCollaborate with cross-functional teams to mitigate technical risks and ensure product development success.\nEstablish process specifications and material requirements while working with suppliers to meet stringent quality standards.\nDocument technical findings, process improvements, and advancements through detailed reports and technical papers.\nProvide support for equipment performance and process health in both development and high-volume manufacturing environments.\nCore Competencies\nStrong communication skills to collaborate across diverse teams and stakeholders. \nStrong analytical skills, including data analysis and risk assessment to inform decision-making.\nQualifications:\nThe Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.\nMinimum Qualifications:\nBachelor's degree in Engineering, Physics, Chemistry, or a related STEM field with 3+ years of industry experience. -OR-\nMaster's degree in Engineering, Physics, Chemistry, or a related STEM field with 2+ years of industry experience. -OR-\nPhD in Engineering, Physics, Chemistry, or a related STEM field with no prior professional experience. \nExperience with process development and/or equipment qualification for manufacturing applications. \nPreferred Qualifications\nExperience leading technical teams and collaborating across matrixed organizations to drive innovation. \nExperience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques\nExperience with semiconductor fabrication processes, packaging flows, and assembly methodologies. \nProven ability to deliver results in time-sensitive technical projects with a focus on process improvement. Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation.\nProficiency in programming languages such as Python, MATLAB, or SQL to analyze complex datasets.\nJoin Intel's world-class technology development team and use your expertise to push the boundaries of innovation in semiconductor packaging. Take the next step in your career and apply today to help shape the future of technology.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5868,"description_truncated":false,"requirements":{"experience_years_min":3,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":["Hybrid work"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-27T05:44:46Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":728}],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":4,"expected_fill_days":30,"reasons":["conf:4","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-10-30T05:48:23Z"},"pay":null,"html_url":"https://alion.io/job/intel-advanced-packaging-development-engineer","json_url":"https://alion.io/job/intel-advanced-packaging-development-engineer.json","meta":{"generated_at":"2026-10-31T02:48:26Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":3927,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-01T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-advanced-packaging-development-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-advanced-packaging-development-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-advanced-packaging-development-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-advanced-packaging-development-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-advanced-packaging-development-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3317025}},{"tool":"search_jobs","arguments":{"company":"intel.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3317025},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. 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