{"id":3595381,"url":"https://alion.io/job/intel-atd-mihl-equipment-development-engineer","title":"ATD MIHL Equipment Development Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":102,"ghost_share":0.029,"stale_share":0.539,"repost_share":0.059,"time_to_fill_p50_days":30,"computed_at":"2026-11-05T05:54:30Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":83000,"max_usd":152000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":4330},"experience_years_min":3,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AutoCAD","optional":false},{"name":"Design of Experiments","optional":false},{"name":"GD&T","optional":false},{"name":"SolidWorks","optional":false},{"name":"Statistical Process Control","optional":false}],"status":"live","first_seen_at":"2026-10-30T00:00:00Z","employer_posted_date":"2026-10-30","last_verified_at":"2026-11-05T04:17:44Z","board_verified":true,"closed_at":null,"days_open":6,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":6},"description":"Job Details:\nJob Description:\nThe Role and Impact\nJoin Intel's Packaging Module Development team as a Packaging Module Development Engineer and contribute to advancing innovative assembly and packaging technologies. In this role, you will develop and optimize processes and equipment to support next-generation packaging solutions. Your work will directly enhance manufacturing efficiency, product reliability, and quality, enabling cutting-edge products that shape Intel's leadership in the semiconductor industry.\nBusiness Group\nIntel's Packaging Module Development team focuses on designing and refining assembly and packaging solutions for Intel's diverse product portfolio. Collaborating with cross-functional teams, this group drives innovation in manufacturing processes and delivers high-quality, reliable solutions that support Intel's mission to deliver world-class technologies to global markets.\nKey Responsibilities\nDevelop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals. \nApply principles of Design of Experiments (DOE) and Statistical Process Control (SPC) to refine processes and specifications, documenting findings through technical reports. \nDesign and maintain equipment to evaluate packaging technologies under simulated field conditions, such as temperature cycles, humidity, heat, and dynamic forces. \nEnsure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows. \nDefine material specifications and collaborate with supplier quality and procurement teams to ensure adherence to quality and performance benchmarks. \nInnovate new techniques, tools, and quality screens to proactively identify and address packaging reliability challenges. \nSet reliability benchmarks based on a thorough understanding of failure mechanisms and customer needs. \nLead problem-solving initiatives and drive continuous improvement in processes and equipment. \nProvide expert consultation to internal teams and partners on packaging challenges and technical solutions. \n Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks.\nQualifications:\nThis position is not eligible for Intel immigration sponsorship.\nMinimum Qualifications\nBachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 3+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 2+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.\nExperience in the following:\nStatistical Process Control (SPC) and Design of Experiments (DOE) principles. \nMechanical design software, such as SolidWorks or AutoCAD. \nMechanical drawings, Geometric Dimensioning, and Tolerancing principles. \nPreferred Qualifications \nExperience in the following:\nProgram management ability to lead technical innovation and manage complex, time-sensitive projects. \nSemiconductor fabrication processes, packaging technologies, and robotics.\nSupply chain management in a manufacturing or materials qualification environment. \nTake the next step in your career and join Intel's team of innovators dedicated to shaping the future of technology.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5394,"description_truncated":false,"requirements":{"experience_years_min":3,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-11-02T02:39:20Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-29T16:27:21+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":63,"band":"ok","label":"Likely open","p_open":1,"p_active":0.632,"p_room":1,"age_days":6,"expected_fill_days":30,"reasons":["conf:1","stale_co","velocity","win:early","comp:brand"],"computed_at":"2026-11-05T05:54:30Z"},"pay":null,"html_url":"https://alion.io/job/intel-atd-mihl-equipment-development-engineer","json_url":"https://alion.io/job/intel-atd-mihl-equipment-development-engineer.json","meta":{"generated_at":"2026-11-05T13:24:31Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":17365,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-11-06T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-atd-mihl-equipment-development-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-atd-mihl-equipment-development-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-atd-mihl-equipment-development-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-atd-mihl-equipment-development-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-atd-mihl-equipment-development-engineer"}],"agent":{"mcp":"https://alion.io/mcp/jobs","mcp_open":"https://alion.io/mcp/open","next":[{"tool":"get_job","arguments":{"id":3595381}},{"tool":"search_jobs","arguments":{"company":"intel.com","detail":"compact"}},{"tool":"match_people","arguments":{"job_id":3595381},"note":"people open to offers who fit this vacancy"}],"note":"The same data through MCP tools: https://alion.io/mcp/open needs no sign-in (compact searches, postings, people); https://alion.io/mcp with an Alion account has everything. Docs: https://alion.io/developers"}}