{"id":2284372,"url":"https://alion.io/job/intel-corporation-3dic-platform-wet-and-plating-development-manager","title":"3DIC Platform Wet and Plating Development Manager","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":124,"ghost_share":0.024,"stale_share":0.556,"repost_share":0.04,"time_to_fill_p50_days":24,"computed_at":"2026-10-22T06:10:10Z"}},"role":"Management","role_family":"Management","seniority":"lead","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":95000,"max_usd":229000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":2726},"experience_years_min":8,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-10-08T00:00:00Z","employer_posted_date":"2026-10-08","last_verified_at":"2026-10-22T00:12:41Z","board_verified":true,"closed_at":null,"days_open":14,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":14},"description":"Job Details:\nJob Description:\nIntel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3DIC platform. This role will drive the development and implementation of Wet Clean/Plating processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in Wet and Plating system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.\nKey Responsibilities\nLead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment\nFormulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging\nOversee development of production-worthy wet etch/plating processes for high-volume manufacturing\nFoster talent development for critical technical roles, and drive technical excellence and innovation within the wet etch(clean)/plating team\nDevelop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams\nDrive Wet Etch(clean) and Plating module and segment related yield improvement initiatives and defect reduction programs\nPartner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing\nThe candidate should exhibit the following behavioral traits:\nExcellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.\nStrategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.\nMinimum Qualifications\nMaster or PhD degree in Chemistry, Materials Science, Physics, Electrical Engineering, Mechanical Engineering, or a related field, with 8+ years of relevant experience at a Master's degree, 6+ years or experience with a PhD degree.\nThe experience listed above should include a combination of the following qualifications:Wet Etch/Clean or Plating experience and hands-on experience working with various wet etch and/or plating platforms.\nProject management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.\n\nPreferred Qualifications\nBuild and lead effective teams, including fostering an inclusive, productive, and innovative team culture.\nRich experience with vendor relations, including material quality assessments and performance management.\nStrong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $180,770.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5202,"description_truncated":false,"requirements":{"experience_years_min":8,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-11T13:05:21Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":51,"band":"ok","label":"Likely open","p_open":1,"p_active":0.57,"p_room":0.9,"age_days":14,"expected_fill_days":24,"reasons":["conf:5","stale_co","velocity","win:mid","comp:brand"],"computed_at":"2026-10-22T06:10:10Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-3dic-platform-wet-and-plating-development-manager","json_url":"https://alion.io/job/intel-corporation-3dic-platform-wet-and-plating-development-manager.json","meta":{"generated_at":"2026-10-22T23:28:55Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":9330,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-23T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-corporation-3dic-platform-wet-and-plating-development-manager"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-corporation-3dic-platform-wet-and-plating-development-manager"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-corporation-3dic-platform-wet-and-plating-development-manager"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-corporation-3dic-platform-wet-and-plating-development-manager\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-corporation-3dic-platform-wet-and-plating-development-manager"}]}