{"id":2284443,"url":"https://alion.io/job/intel-corporation-cpu-core-physical-design-technical-graduate-intern-spring","title":"CPU Core Physical Design Technical Graduate Intern, Spring","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":101,"ghost_share":0.02,"stale_share":0.584,"repost_share":0.04,"time_to_fill_p50_days":27,"computed_at":"2026-10-19T05:45:15Z"}},"role":"Early Careers","role_family":"Early Careers","seniority":"intern","employment_type":"internship","work_mode":"hybrid","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Folsom, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":50000,"max_usd":84000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":346},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Perl","optional":false},{"name":"Python","optional":false}],"status":"live","first_seen_at":"2026-10-05T00:00:00Z","employer_posted_date":"2026-10-05","last_verified_at":"2026-10-18T16:21:57Z","board_verified":true,"closed_at":null,"days_open":14,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":14},"description":"Job Details:\nJob Description:\nThe Role and Impact\nAs a 2027 Physical Design Engineering Graduate Intern, you will contribute to the physical implementation of silicon designs to create manufacturing-ready solutions. Your day-to-day work will involve tasks such as synthesis, place and route, timing analysis, clocking, and/or integration. By assisting in verification and signoff activities, you will ensure manufacturability and performance compliance, directly supporting Intel's broader innovation goals.\nBusiness group\nThe Data Center Group (DCG) is at the forefront of transforming data-centric technologies by delivering solutions that power Intel's silicon and platform advancements. Focused on high-performance computing, storage, and connectivity, DCG plays a vital role in shaping Intel's impact across industries, enabling scalable, automated, and impactful designs for modern infrastructure challenges.\nJanuary 2027 - August 2027\nIdeal candidate is local to Folsom area or will arrange for a semester away.\nRelocation is available.\nKey Responsibilities\n- Support physical design implementation, including synthesis, place and route, and integration. \n- Conduct timing analysis and clocking to optimize design performance. \n- Assist in verification and signoff activities to ensure manufacturability and compliance. \n- Collaborate with cross-functional teams to enhance design scalability and automation. \n- Learn and apply knowledge through hands-on tasks and projects aligned with Intel's goals.\nQualifications:\nMinimum Qualifications\nPursuing a Master's degree in Electrical Engineering (EE), Computer Engineering (CE), or a related field.\nCoursework, academic projects, or research experience in digital integrated circuit design and VLSI physical design.\nFundamental knowledge of logic synthesis, place and route, and static timing analysis (STA).\nExperience with one or more scripting/programming languages such as Perl, Tcl, or Python.\nUnderstanding of semiconductor design flows and ASIC/SoC implementation concepts.\nPreferred Qualifications\nExperience with synthesis, place and route, and timing analysis.\nKnowledge of low-power design techniques and PPA optimization.\nProgramming experience with Perl, Tcl, and/or Python.\nFamiliarity with ASIC/SoC physical design flows and EDA tools.\nExperience from coursework, research, or projects in VLSI or semiconductor design.\nJob Type:\nStudent / InternShift:\nShift 1 (United States of America)Primary Location:\nUS, California, FolsomAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $105,698.00-105,702.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.Work Model for this Role\nThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":4394,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"master","optional":false},"security_clearance":false,"languages":[]},"benefits":["Hybrid work"],"hiring_locations":[{"name":"United States","iso":"US","kind":"country"}],"hiring_excludes":[],"relocation_offered":true,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-11T13:05:21Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-15T11:24:14+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":54,"band":"ok","label":"Likely open","p_open":1,"p_active":0.605,"p_room":0.9,"age_days":14,"expected_fill_days":27,"reasons":["conf:13","stale_co","velocity","win:mid","comp:junior,brand"],"computed_at":"2026-10-19T05:45:15Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-cpu-core-physical-design-technical-graduate-intern-spring","json_url":"https://alion.io/job/intel-corporation-cpu-core-physical-design-technical-graduate-intern-spring.json","meta":{"generated_at":"2026-10-19T21:58:04Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":984,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-20T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-corporation-cpu-core-physical-design-technical-graduate-intern-spring"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-corporation-cpu-core-physical-design-technical-graduate-intern-spring"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-corporation-cpu-core-physical-design-technical-graduate-intern-spring"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-corporation-cpu-core-physical-design-technical-graduate-intern-spring\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-corporation-cpu-core-physical-design-technical-graduate-intern-spring"}]}