{"id":2284414,"url":"https://alion.io/job/intel-corporation-defect-characterization-low-yield-analysis-engineer","title":"Defect Characterization Low Yield Analysis Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":83,"open_postings":72,"ghost_share":0,"stale_share":0.639,"repost_share":0.042,"time_to_fill_p50_days":29,"computed_at":"2026-10-10T05:45:15Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"middle","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":81000,"max_usd":150000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":3300},"experience_years_min":3,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"Python","optional":true},{"name":"SQL","optional":true}],"status":"live","first_seen_at":"2026-10-07T00:00:00Z","employer_posted_date":"2026-10-07","last_verified_at":"2026-10-11T23:05:14Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Job Details:\nJob Description:\nAs a Low Yield Analysis (LYA) Engineer within Intel Foundry's Defect Characterization organization, you will drive root cause identification and yield improvement strategies for advanced packaging assembly and substrate technology development programs. You will lead complex technical investigations, develop innovative characterization methodologies, and collaborate across manufacturing, quality, process integration, design, and module technology development organizations to resolve critical yield challenges.\nThis role requires a strong sense of ownership, urgency, technical leadership, and customer focus. The successful candidate will independently drive investigations, influence technical decisions, mentor team members, and deliver measurable business impact through yield improvement and defect characterization excellence.\nResponsibilities\nLead end-to-end investigations to identify and resolve complex yield, defect, and quality issues.\nServe as a technical owner for major factory, platform, or technology development programs.\nDefine characterization strategies, learning plans, and root cause methodologies for critical technical challenges.\nUtilize advanced analytical techniques including Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms.\nCorrelate characterization results with electrical data, defect inspection data, process history, and manufacturing information to establish root cause.\nConsolidate and analyze large data sets using statistical methods and coding tools to identify yield limiters and emerging trends.\nDevelop and implement tools, dashboards, automation, and analytical methodologies that improve learning velocity and analysis efficiency.\nDrive corrective actions and influence process improvements across manufacturing, integration, quality, and technology organizations.\nLead cross-functional task forces and technical reviews to address high-priority yield and reliability issues.\nPresent technical findings, recommendations, and risk assessments to engineering and management teams.\nMentor engineers and technicians while promoting best-known methods and organizational learning.\nSupport future capability development through equipment strategy, methodology development, and characterization roadmap planning.\nEffectively manage multiple high-priority investigations while balancing customer commitments, factory priorities, and business needs.\nBehavioral traits\nDemonstrated success managing multiple competing priorities in a fast-paced manufacturing or development environment.\nCommunicate findings verbally and through reports to yield engineers, LYA analysts, and other customers.\nWork in a collaborative manner with a variety of different individuals in a fast paced, technical environment.\nExperience independently driving technical investigations and root cause analysis activities.\nIndependently own open-ended technical problems, proactively drive actions across organizations, and deliver measurable business impact through root cause identification and implementation of corrective actions.\nProblem-solving, analytical, and troubleshooting skills.\nVerbal and written communication skills to communicate technical findings to diverse audiences.\nOperate effectively in ambiguous environments and drive technical issues to closure with minimal direction.\nThis role is lab-based and on-site required.\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.\nExperience listed below would be obtained through schoolwork and/or classes and/or project work and/or internships and/or military training and/or work experience.\nMinimum Qualifications\nMaster's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field with 3+ years of relevant semiconductor industry or failure analysis lab experience OR PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field.\nPreferred Qualifications:\nPrior experience working in a lab environment with hands-on experience with failure analysis and characterization techniques such as Optical Microscopy, SEM/EDS, CSAM, FTIR, Raman, TEM, EBSD, XRD or similar methodologies.\nExperience with mechanical cross-sectioning, planar grinding, ion milling, focused ion beam (FIB), and advanced sample preparation techniques.\nAdvanced knowledge of semiconductor packaging, assembly, substrate manufacturing, or related process technologies.\nProficiency with statistical analysis and data analytics tools such as Python, JMP, JSL, SQL, or equivalent.\nTrack record of mentoring engineers and technicians and contributing to organizational capability development.\nExperience developing new characterization techniques, analytical workflows, or problem-solving methodologies.\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. 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