{"id":827129,"url":"https://alion.io/job/intel-corporation-module-engineering-phd-intern-new-2027","title":"Module Engineering PhD Intern New 2027","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":98,"ghost_share":0.02,"stale_share":0.571,"repost_share":0.041,"time_to_fill_p50_days":27,"computed_at":"2026-10-15T05:46:00Z"}},"role":"Early Careers","role_family":"Early Careers","seniority":"intern","employment_type":"internship","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Hillsboro, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":49000,"max_usd":82000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":346},"experience_years_min":null,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-11T00:00:00Z","employer_posted_date":"2026-09-11","last_verified_at":"2026-10-14T14:33:55Z","board_verified":true,"closed_at":null,"days_open":34,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":34},"description":"Job Details:\nJob Description:\nAs one of the world's largest chip manufacturers, and a global leader in innovative technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world-class Supply Chain and facilities support.\nJoin us at Intel Foundry Logic Technology Development (LTD) for a Graduate internship and participate in creating the next generation of technologies that will shape the future for decades to come. LTD intern would conduct scientific research to enable manufacturing of innovative device architectures. They would engage in designing, executing and analyzing experiments necessary to meet engineering specifications for their process, and participate in process and equipment development.\nThe Role and Impact\nIn this role, you will contribute to module process development, process integration flows, and equipment configuration for manufacturing modules. Work may also include support for yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. You will work in collaboration with engineering teams to optimize metrology strategies, troubleshoot process flow issues, and continuously improve the process in preparation for high-volume manufacturing environment. As an intern, you will have an opportunity to learn and apply your knowledge, build skills, and explore future career opportunities through hands-on experience and projects that support Intel business goals in a collaborative environment.\n Business group\nAs part of Intel Foundry, you will join Logic Technology Development (LTD) Metals team that focuses on Metals Thin Films Deposition within semiconductor manufacturing. The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's product roadmap. We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. The team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands.\nKey Responsibilities\nContribute to process development, continuous improvement, and implementation of semiconductor manufacturing processes for a specific module within LTD Metals.to help develop and improve our processes\n\nDesign, execute, analyze experiments and present conclusions and recommendations to the group\n\nCollaborate with fab technicians and support experiment execution with clear instructions\n\nAssist engineering teams in process flow troubleshooting and metrology optimization strategies\n\nApply statistical analysis and design experiments to enhance process reliability and throughput.\n\nGain experience in materials and device characterization techniques, such as ellipsometry, xray-based techniques, 4-point probe, AFM, SEM and TEM.\n\nQualifications:\n Minimum Qualifications\nPhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field of study.\n\nKnowledge of semiconductor processing fundamentals, including thin films deposition, lithography, etching, polishing.\n\nExperience in thin films materials deposition techniques (ALD, CVD, PVD or electroplating) and characterization (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM, etc.), hands-on lab/fab equipment experience\n\nData analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment\n\n Preferred Qualifications\nPhD student 3rd or 4th year; experience with thin film deposition and characterization\n\nIf you're eager to advance your expertise in semiconductor technology, collaborate in a supportive environment, and contribute to innovative solutions that shape the future of manufacturing, we encourage you to consider this opportunity.\nJob Type:\nStudent / InternShift:\nShift 1 (United States of America)Primary Location:\nUS, Oregon, HillsboroAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":5896,"description_truncated":false,"requirements":{"experience_years_min":null,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"phd","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-09-12T15:06:45Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":17,"band":"cold","label":"Long shot","p_open":1,"p_active":0.382,"p_room":0.44,"age_days":34,"expected_fill_days":27,"reasons":["conf:15","stale_co","velocity","win:tail","crowd:junior,brand"],"computed_at":"2026-10-15T05:46:00Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-module-engineering-phd-intern-new-2027","json_url":"https://alion.io/job/intel-corporation-module-engineering-phd-intern-new-2027.json","meta":{"generated_at":"2026-10-15T10:47:53Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":16468,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-16T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-corporation-module-engineering-phd-intern-new-2027"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-corporation-module-engineering-phd-intern-new-2027"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-corporation-module-engineering-phd-intern-new-2027"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-corporation-module-engineering-phd-intern-new-2027\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-corporation-module-engineering-phd-intern-new-2027"}]}