{"id":827128,"url":"https://alion.io/job/intel-corporation-module-engineering-phd-intern","title":"Module Engineering PhD Intern","company":{"id":35,"name":"Intel Corporation","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"B","score":84,"open_postings":62,"ghost_share":0,"stale_share":0.613,"repost_share":0.032,"time_to_fill_p50_days":29,"computed_at":"2026-10-03T05:45:00Z"}},"role":"Early Careers","role_family":"Early Careers","seniority":"intern","employment_type":"internship","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":50000,"max_usd":86000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":145},"experience_years_min":3,"visa_sponsorship":true,"relocation_package":false,"has_equity":false,"technologies":[],"status":"live","first_seen_at":"2026-09-11T00:00:00Z","employer_posted_date":"2026-09-11","last_verified_at":"2026-10-03T23:41:49Z","board_verified":true,"closed_at":null,"days_open":23,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":23},"description":"Job Details:\nJob Description:\nMaterials Technology Development (MTD) is looking for a Summer Intern 2027 in Assembly Technology Development (ATD).\nAs a Module Engineering - Graduate Intern, you will:\nConduct fundamental research and experimentation to characterize materials, identify potential failure modes, understand structure-property-performance relationships, assess material feasibility for product applications, and provide strategic material technology recommendations.\n\nCollaborate closely with materials suppliers to develop and source material formulations that meet stringent technology, quality, availability, and cost requirements.\n\nDevelop comprehensive understanding of Intel's assembly processes, material interactions, and their impact on overall product performance.\n\nPartners with Equipment and Process Engineering teams implement material technologies on test vehicles and products while evaluating their performance metrics.\n\nDesign and develop assembly processes and equipment by applying innovative concepts and novel solutions to enable Intel's roadmap for next-generation assembly packaging platform technologies.\n\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience.\nMinimum Qualifications:\nEducation: The candidate must be a full-time student pursuing a Ph.D. degree in the following disciplines:\nMaterials Science and Engineering\nChemical Engineering\nChemistry\nPolymer Science or Polymer Chemistry\nMetallurgy or related technical fields\n6+ months / 1+ years of relevant experience in:\nFundamental research and experimentation\nPreferred Qualifications:\nCandidates should also demonstrate the following behavioral traits and skills:\nTechnical problem-solving abilities.\nStrong presentation and communication skills.\nFast-learning capabilities and deep technical expertise in their field.\nAbility to collaborate effectively across multiple teams.\nThis position is not eligible for employment-based visa/immigration sponsorship.\nIntel sponsors individuals for employment-based visas for positions where we experience a shortage of U.S. workers. These skills shortage roles are typically STEM positions requiring a Master's or PhD degree, or a Bachelor's degree with at least three years of post-degree related job experience. This position does not qualify for Intel sponsorship because it is either a non-STEM position, or a STEM position that only requires a Bachelor's degree and less than three years' experience.\nFor information on Intel's immigration sponsorship guidelines, please see: https://www.intel.com/content/www/us/en/jobs/hiring.html\nJob Type:\nStudent / InternShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":4715,"description_truncated":false,"requirements":{"experience_years_min":3,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-09-12T15:06:45Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":39,"band":"fade","label":"Fading","p_open":1,"p_active":0.519,"p_room":0.75,"age_days":22,"expected_fill_days":29,"reasons":["conf:1","stale_co","velocity","win:late","comp:junior,brand"],"computed_at":"2026-10-03T05:45:00Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-module-engineering-phd-intern","json_url":"https://alion.io/job/intel-corporation-module-engineering-phd-intern.json","meta":{"generated_at":"2026-10-04T01:59:33Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","usage":{"tier":"crawler","counted_by":"address","units_charged":1,"used_today":2711,"day_limit":5000,"remaining_today":2289,"minute_limit":60,"resets_at":"2026-10-05T00:00:00Z"}}}