{"id":2284409,"url":"https://alion.io/job/intel-corporation-packaging-process-development-engineer","title":"Packaging Process Development Engineer","company":{"id":35,"name":"Intel","domain":"intel.com","url":"https://alion.io/company/intel","size_band":"5000+","is_staffing_agency":false,"employer_type":"direct","is_intermediary":false,"listed_via":null,"ats_vendor":"Workday","truth_index":{"grade":"A","score":86,"open_postings":91,"ghost_share":0,"stale_share":0.527,"repost_share":0.044,"time_to_fill_p50_days":27,"computed_at":"2026-10-12T06:55:09Z"}},"role":"Industrial Engineering","role_family":"Industrial Engineering","seniority":"junior","employment_type":"full_time","work_mode":"on_site","remote_scope":null,"remote_scope_basis":null,"remote_working_hours":null,"hiring_geo_confidence":"structured","locations":["Chandler, United States"],"countries":["US"],"hiring_countries":[],"hiring_countries_total":0,"salary":null,"salary_estimate":{"min_usd":68000,"max_usd":122000,"period":"year","method":"role_seniority_country_remote_cell","sample_n":3358},"experience_years_min":2,"visa_sponsorship":false,"relocation_package":false,"has_equity":false,"technologies":[{"name":"AutoCAD","optional":true},{"name":"SolidWorks","optional":true}],"status":"live","first_seen_at":"2026-10-07T00:00:00Z","employer_posted_date":"2026-10-07","last_verified_at":"2026-10-12T13:24:48Z","board_verified":true,"closed_at":null,"days_open":5,"trust":{"level":"ok","repost_count":null,"flags":[],"days_open":5},"description":"Job Details:\nJob Description:\nIntel Corporation is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and artificial intelligence. With a legacy of over 50 years of technological breakthroughs, Intel empowers billions of people globally through world-class products and solutions. Our teams are made up of bold thinkers, problem-solvers, and innovators who are passionate about shaping the future of technology. At Intel, we believe in creating an inclusive workplace where diverse perspectives fuel creativity and drive meaningful impact.\nIntel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of advancing next-generation semiconductor packaging technologies, playing a critical part in Intel's product roadmap. You will develop and optimize innovative assembly processes and equipment, directly influencing the performance, reliability, and quality of Intel's cutting-edge products. This is a unique opportunity to make a lasting impact on the semiconductor industry while working alongside some of the brightest minds in the field.\nKey Responsibilities:\nDevelop and optimize assembly media and collaterals to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.\nApply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine media and collateral capabilities, documenting findings through detailed technical reports.\nDesign and maintain equipment to evaluate media and collateral performance under simulated field conditions, including temperature cycles, heat, humidity, and dynamic mechanical forces.\nEnsure manufacturability of physical prototypes and oversee the full lifecycle of manufacturing workflows.\nDefine material specifications and collaborate closely with supplier quality and procurement teams to maintain compliance with quality and performance benchmarks.\nLeverage a deep understanding of failure mechanisms to establish reliability benchmarks aligned with customer requirements.\nLead problem-solving initiatives and champion continuous improvement efforts for media and collaterals.\nStandardize manufacturing qualification practices and quality systems while managing technical risks in alignment with product milestones and supplier delivery schedules.\nServe as a subject matter expert, providing technical consultation to internal teams and external partners on media and collateral solutions.\nAs a Successful Candidate, You Will Bring:\nCollaborative mindset - You thrive in cross-functional team environments and build strong relationships with colleagues, suppliers, and partners.\nAnalytical thinking - You approach complex problems with a structured, data-driven mindset and a passion for finding root causes.\nEffective communication - You can clearly articulate technical concepts to both technical and non-technical audiences, both verbally and in writing.\nAdaptability - You are comfortable navigating ambiguity and shifting priorities in a fast-paced, innovation-driven environment.\nAttention to detail - You take pride in precision and thoroughness, ensuring quality and accuracy in everything you do.\nInitiative & ownership - You proactively identify opportunities for improvement and take ownership of outcomes from start to finish.\nResilience - You remain focused and solution-oriented when faced with challenges or setbacks.\nAre you ready to make your mark on the future of semiconductor packaging? Join Intel's team of world-class innovators in Arizona and help redefine what's possible in next-generation packaging technologies. Apply today and take the next step in your engineering career at one of the most iconic technology companies in the world.\nQualifications:\nYou must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience.\nMinimum Qualifications:\nBachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years of experience\nOR master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM field\nRelevant experience should be in the following:Knowledge of mechanical design software such as SolidWorks or AutoCAD.\nMechanical drawings, Geometric Dimensioning and Tolerancing (GD&T) principles\n\nPreferred Qualifications:\n2+ years of experience in:Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.\nDrive technical innovation and manage complex, time-sensitive projects.\nHigh-precision manufacturing methods, including stamping and CNC machining.\nSemiconductor fabrication processes and packaging technologies.\nSupply chain management in a manufacturing or materials qualification environment.\n\nJob Type:\nExperienced HireShift:\nShift 1 (United States of America)Primary Location:\nUS, Arizona, PhoenixAdditional Locations:\nPosting Statement:\nAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust\nN/ABenefits\nWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.\nAnnual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this Role\nThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*\nADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.","description_format":"text","description_chars":7137,"description_truncated":false,"requirements":{"experience_years_min":2,"management_years_min":null,"team_size_min":null,"manages_managers":false,"education":{"level":"bachelor","optional":false},"security_clearance":false,"languages":[]},"benefits":[],"hiring_locations":[],"hiring_excludes":[],"relocation_offered":false,"industries":["Processors, MCUs & AI Chips","Semiconductor Manufacturing","Computer Components","AI Chips & Accelerators"],"lifecycle":[{"event":"open","at":"2026-10-11T13:05:21Z"}],"visa":[{"country":"US","licensed_sponsor":true,"evidence":"H-1B filings in 12 months: 2,014 · green card filings: 487","filings_12m":2014,"filings_prev_12m":3001,"green_card_filings_12m":487,"median_offered_wage_usd":134579,"route":null,"cap_exempt":false,"checked_at":"2026-10-03T21:08:04+00:00","sources":["US Department of Labor: LCA disclosure data (H-1B, H-1B1, E-3)","US Department of Labor: PERM disclosure data (green cards)"],"filings_for_role_12m":0}],"liveness":{"score":57,"band":"ok","label":"Likely open","p_open":1,"p_active":0.573,"p_room":1,"age_days":5,"expected_fill_days":27,"reasons":["conf:0","stale_co","win:early","comp:junior,brand"],"computed_at":"2026-10-12T06:55:09Z"},"pay":null,"html_url":"https://alion.io/job/intel-corporation-packaging-process-development-engineer","json_url":"https://alion.io/job/intel-corporation-packaging-process-development-engineer.json","meta":{"generated_at":"2026-10-12T14:57:21Z","cache_seconds":300,"methodology":"https://alion.io/methodology","terms":"https://alion.io/terms","contact":"https://alion.io/contact","api":"https://alion.io/developers","about":"Alion is a live layer of people, companies and AI agents: who they are, whether they are real and active right now, what they do and how to work with them, readable by people and by agents and paid per call.","catalog":"https://alion.io/catalog.json","usage":{"tier":"crawler_verified","counted_by":"address","units_charged":1,"used_today":23631,"day_limit":null,"remaining_today":null,"minute_limit":300,"resets_at":"2026-10-13T00:00:00Z"}},"offers":[{"id":"company.slices","title":"One company in depth, by slice","status":"live","price":{"credits":0.02,"usd":0.002,"plus_per_slice":{"credits":0.05,"usd":0.005}},"unit":"per company, plus each slice with data","note":"the employer in depth","call":{"mcp_tool":"get_company","arguments":{"id":35},"rest":"https://alion.io/mcp/rest/get_company?id=35"},"human":"https://alion.io/catalog?offer=company.slices&for=job%2Fintel-corporation-packaging-process-development-engineer"},{"id":"market.stats","title":"A market slice: pay, demand and time to fill","status":"live","price":{"credits":1,"usd":0.1},"unit":"per slice","note":"pay, demand and time to fill for this role and place","call":{"mcp_tool":"market_stats"},"human":"https://alion.io/catalog?offer=market.stats&for=job%2Fintel-corporation-packaging-process-development-engineer"},{"id":"job.search","title":"Open jobs by role, technology, place, pay and visa","status":"live","price":{"credits":0.02,"usd":0.002},"unit":"per posting in a list","note":"similar open postings","call":{"mcp_tool":"search_jobs"},"human":"https://alion.io/catalog?offer=job.search&for=job%2Fintel-corporation-packaging-process-development-engineer"},{"id":"company.verify","title":"Is this company real and active right now","status":"pilot","price":null,"unit":"per company","request":{"url":"https://alion.io/catalog/request","method":"POST","body":"{\"offer\": \"company.verify\", \"for\": \"job/intel-corporation-packaging-process-development-engineer\", \"note\": \"what you need it for\"}"},"human":"https://alion.io/catalog?offer=company.verify&for=job%2Fintel-corporation-packaging-process-development-engineer"}]}